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Company Profile

About SkyHigh Memory Solution (SHM)

SkyHigh Memory is a technology leader that designs, develops, and markets high performance non-volatile Flash
Memory products for the following key markets: (i) automotive, (ii) communications, (iii) digital consumer, and (iv)
industrial and medical.
In 2018, in the peak of tightness in the market, SK Hynix and Cypress have recognized that customers have been
victim to opportunistic behavior in the market. Customers deserves the highest quality product and the world class
services without being penalized by the lack of access to SLC NAND products. That is why, in 2019, Cypress and
SK Hynix have jointly agreed to fund SkyHigh memory. SkyHigh is committed to provide unparallel quality product
and services to our customers and large supply.
In less than 6 months from its creation, SkyHigh will be introducing new SLC NAND and e.MMC products on the most
advanced technology node as commitment to offer cost reduction and product longevity to our customers.
For more information about these new products, please contact sales.
SkyHigh strength lies on its strong foundry and manufacturing partners and its employees. Its team of engineers and
sales is highly knowledgeable and is worldwide recognized for its commitment to provide the best in class product and
best services. From 2012, when SkyHigh’s SLC NAND product families were launched under Spansion banner, the team
has sold over 200M devices to leading customers in each of its target markets.
Some key elements of Skyhigh Memory strategy to become the leader for high reliable and performance storage
solution are based on:

  • Strong Collaborative Relationships with its foundry and manufacturing partners. We work in a highly collaborative
    mode with our principal wafer foundry to develop leading edge process technology and provide “unlimited”
    wafer capacity.

  • Strong Engineering team qualifying each product to Automotive standard. Proven record of delivering Automotive
    grade devices to Automotive worldwide OEM Leaders.

  • Investing, Developing and Offering High Reliable and Performance Products.

  • Providing a World Wide Support to our customers.

  • Being a Long-Term and stable Supplier to our customers.

  • Leveraging our expertise in producing high-quality memory products to be the leader in our target markets.


For more information about SkyHigh Memory and our products, please contact your local sales representative.

SkyHigh Memory’s Milestones

Since beginning development of NAND Flash Memory in 2003, SK hynix has become a top 5 supplier with over 10%
share of the nearly $60 billion market in 2018.
SK hynix has provided SLC NAND to Cypress through a long-term supply agreement from 2012 to 2018.
SK hynix system ic, 100% subsidiary of SK hynix, entered into a joint venture agreement with Cypress Semiconductor
Corp. in October 2018.
Official launch of SkyHigh Memory took place on April 1, 2019. Since then, SkyHigh Memory supplies its high
performance, non-volatile Flash Memory products to customers worldwide.

Management

Gihyun Bae CEO
Gihyun Bae is president and chief executive officer at SkyHigh Memory. During execution of SkyHigh Memory JV, Mr. Bae was a key member of JV management team to provide proactive support and supervise all processes and appointed as CEO since the Day of 1 of SkyHigh Memory.
Mr. Bae has over 30 years of extensive business experience in memory technology development and product engineering. Prior to joining SkyHigh Memory, Mr. Bae led a whole NAND flash memory development division at SK Hynix as Senior Vice President and contributed to generating tens of billions of dollars in revenue. He had led strategic co-development partnership with STMicroelectronics from scratch of NAND development since 2001 and played a key role in building strategic NAND business partnerships with key OEM customers at SK Hynix. Mr. Bae has continued serving as an executive consultant for memory storage business sector and strategic business development at other SK group affiliates.
Mr. Bae has received Prime Minister’s award from Korea Semiconductor Industry Association for his achievements in NAND technology development at SK Hynix. He holds a BS of EE from Kyungbuk National University.
JS Yang Executive Engineering VP
JS Yang is executive vice president of Engineering and Manufacturing and chief technology officer at SkyHigh Memory. Mr. Yang joined the company on January 1st of 2020, and brings 30 plus years of experience in NAND product and solution development from SK hynix.
Mr. Yang had been involved in early stages of NAND business development and as part of the NAND business development division he has worked with Mr. Bae for several years . As vice president at SK hynix, he had contributed to NAND design and product engineering and solution firmware development etc.
Mr. Yang has demonstrated excellence in building a reliable technology partnership with major tech companies such as Apple, Samsung Electronics, and Huawei and delivering most satisfying level of their NAND product performance and solution technology optimization. Through the past experiences he has become an expert in understanding the essence of customer’s requirements and apply his skills and knowledge to achieve optimum results in product development. Mr. Yang holds a Bachelor of Science in Physics from Seoul University and Master degree from Korea Advanced Institute of Science and Technology , KAIST.
DK Yoon Strategic Business Planning & Finance VP
DK Yoon is vice president of Sales Planning and Operations Division and responsible for Corporate business planning, Supply chain management, and internal sales support. Mr. Yoon has over 28 years of experience in the memory industry. Prior to joining SkyHigh Memory, he spent most of his career in various management roles in sales, marketing and operations at SKhynix in Korea, Europe, South-East Asia and China. Mr. Yoon has a lot of experience and understanding of the memory market and applications in IT industries, he always strives to meet customers’ expectation through the best supply chain management and support the company through effective cost management.
Harrison Chung APAC Sales VP
Harrison Chung is vice president of Global Sales and brings 20 plus years of global business development, sales experience and broad understanding of different cultures to SkyHigh Memory. Prior to joining SkyHigh Memory, Mr. Chung worked at SK Hynix in the sales and marketing areas covering up all the regions across the world from Korea Domestic market and Americas. Mr. Chung also served as expatriate in Taiwan and Germany. Through past sales experiences, Mr. Chung has developed a good and proficient knowledge and proven record of excellent customer service by effectively managing and organizing the customers’ requirements and building a great reputation and achieve customers’ high satisfaction level which led him to winning many corporate awards such as the SK Hynix President’s Sales Performance award.
Choonyub (CY) Choi Europe Sales GM
CY Choi is the General Sales Manager for EMEA market and brining 30 plus years of extensive international sales and business development experience in technology industry to the company. Before joining SkyHigh Memory, he served as VP of worldwide Sales and Managing Director at SK Hynix and spent a half of his career in Europe. He mainly leaded Memory Products Sales and developed a comprehensive understanding on the memory market and the customer needs, and has always listened to the customers to provide the best customers satisfactions.
Ashish Patel America Sales GM
Ashish Patel is Director of Marketing, brings to SkyHigh Memory 20 years of experience in the memory industry. Until he joined SkyHigh Memory, Mr. Patel has spent most of his career in various management roles in sales, marketing and operations at Spansion and Cypress Semiconductor. Mr. Patel employs his deep understanding of our worldwide customers and applications while relying on his operational excellence to ensure that customer satisfaction is his top priority. Mr. Patel holds a BS of engineering from California Polytechnic State Universiy, San Luis Obispo.
Mike Malzenski Americas Sales GM
Mike Malzenski is the General Manager for Americas Sales. Through his 30 plus years of sales experience, Mr. Malzenski has been able to quickly engage with SkyHigh Memory’s strategic customers, distribution partners, and geographic territories based on his extensive relationships and sales management history with Advanced Micro Devices and Spansion Semiconductor. His background in memory sales to the embedded market has also been an asset. Mr. Malzenski has had various roles in Silicon Valley, Boston, Florida and Chicago including Director of Sales for Embedded and Strategic accounts. Mr. Malzenski holds a BS of EE from the University of Massachusetts.
Joshua Min Korea/Japan Sales Director
Joshua Min(Min Yohan) is the Director for Korea/Japan sales team. Mr. Min has 15+ years of extensive development and sales experience in various memory products especially in SLC/eMMC/eMCP/DRAM memory products. He has developed excellent sales tactics and skills in global market by demonstrating technical support and management and identifying customer requirements for Value-added design Win based on broad key customer relationship and knowledge on cutting edge technology. He also drives regional sales forces with effective teamwork through conative and uplifted motivation. Prior to joining SkyHigh Memory, he worked for highly competitive IT companies such as Samsung, Siliconmotion(SMI), Hana Micron.
Takanori Shiga Sr. Engineering Director
Takanori Shiga is Director of Engineering for SkyHigh Memory and has over 20 years of experience in a range of engineering roles at major technology companies.
Prior to joining SHM, Mr. Shiga was Product Engineering Director at Cypress Semiconductor and Spansion (prior to the merger with Cypress) where he was responsible for the development and qualification of NAND products. Mr. Shiga was instrumental in developing Spansion’s first automotive grade NAND products. Previously, Mr. Shiga held various engineering roles at Fujitsu where he developed multiple generations of NOR Flash memory.
Kuesup NoSr. Engineering Director
Kuesup No is Sr. Director of Engineering for SkyHigh Memory and has over 27 years of experience in semiconductor product development segment. Mr. No has a broad range of working skills and know-hows in new flash memory development and mass production and memory fail analysis. Prior to joining SHM, Mr. No was Product Engineering Director at SK hynix where he was responsible for the development and qualification of NAND and NOR products. Mr. No has experience in leading the development of wafer test and pkg test baseline at SK hynix, and he has been involved from initial product design and development stage to mass production and achieved introducing new cutting edge NAND products by working with brilliant team of engineers.
Mohamed Sardi Product Marketing Director
Mohamed Sardi is Product Marketing Director since SkyHigh Memory’s founding. He is a highly versatile technical marketing and business development leader, bridging technical concepts and business objectives. Prior to joining SkyHigh Memory, Mr. Sardi was the Senior Staff Product Marketing Engineer, leading all Cypress’s NAND Flash memory product families marketing and engineering activities. Mr. Sardi holds 6 US patents, an executive MBA from Santa Clara University, two Master of Science degrees: a EE and a Telecommunication System degree.
Mohammad Nada Marketing Director – Application Engineering
Mohammad Nada is Principal Application Engineer at SkyHigh Memory where he leads product definition, customer support, and all other Application Engineering responsibilities. joined SkyHigh Memory as an early senior technical member, with over 30 years of engineering, development, and management experience. Prior to joining SkyHigh Memory, he worked at Cypress Semiconductor. Mr. Nada has more than 15 years of experience in the development of NAND flash and managed NAND controllers. Mr. Nada holds a Bachelor of Science in Electrical Engineering from Southern Illinois University and an MBA from National University.
Julie Ahn Sr. Sales Planning Director
Julie Ahn is Sr. Director of Sales Planning and brings 20 plus years of marketing and global memory business experience and broad understanding of different cultures to SkyHigh Memory. Prior to joining SkyHigh Memory, Ms. Ahn has worked at SK Hynix as key member of marketing team and also served as expatriate in Taiwan. Through past sales and marketing experiences, Ms. Ahn has developed a good and proficient knowledge of memory product families marketing and excellent analytic skills to execute sales strategies to increase SkyHigh Memory’s market share.
Robert Park Sr. Director of CQE
Robert Park is Quality Engineering Director with 20 plus years of extensive experience in quality engineering field and technical marketing. He brings superior quality, reliability and services to customers. Prior to joining SkyHigh Memory, he worked at SK Hynix. Mr. Park understands that business success depends on developing a ‘best-of-bread’ Quality Management System for designed to deliver world-class products, uncompromising service, and total customer satisfaction.

ONFI SLC NAND [Single Level Cell]

Overview

SkyHigh Memory NAND products add reliable, high density data storage to the Cypress flash product line.
Cypress applies its stringent process for qualification, testing, extended temperature support and packaging to its line
of SLC NAND products.


SkyHigh Memory’s high performance and high reliability SLC NAND product portfolio includes two standard product families supporting 1bit and 4 bit ECC options. They are available in 1Gb to 16Gb densities.
SkyHigh Memory offers SLC NAND products with operating temperatures up to +105°C, compact packages to fit in
small form factors and meet stringent quality standards including AEC-Q100 for automotive applications.


All our NAND Flash Memory products are targeted specifically for data storage in Automotive Instrument Clusters and Infotainment Systems, Communication Equipment, Consumer Electronics and Industrial Automation. SLC Flash Memory Product OverviewPDF | 217 KB

SLC NAND Products Highlights

  • Densities : 1Gb to 16Gb

  • Voltages : 3 V and 1.8 V options

  • Endurance : 100,000 P/E cycles (typical)

  • Data Retention : 10 years (typical)

  • ECC Requirements : 1-bit or 4-bit options

  • Bus Width : x8 or x16 options

  • Temperature :
    Industrial temp range (-40°C to 85°C)
    Industrial plus temp range (-40°C to 105°C)

  • Packages :
    48-pin TSOP 12 mm x 20 mm
    63-ball BGA 9 mm x 11 mm
    67-ball BGA 8 mm x 6.5 mm

  • Open NAND Flash Interface (ONFI) 1.0 compliant

  • AEC-Q100 qualification

  • Complementary drivers and Cypress Flash File System (FFS)

SecureNAND™

For applications where security is a priority, SkyHigh Memory also offers the SL SecureNAND™ Flash Memory family
which provides enhanced protection features. Commodity SLC NAND Flash Memory products do not provide
security features required for storage of sensitive boot code, system firmware and applications.


SkyHigh Memory SecureNAND Flash Memory products provide volatile and nonvolatile block protection features that
can be used to protect boot code, system firmware and applications. With volatile block protection, a single block or a range of blocks can be chosen to lock the specified area until the next power cycle. With nonvolatile block protection,
a range of blocks or an expandable range of blocks can be locked permanently. This provides a greater amount of flexibility without having to worry about limitations on the number of blocks that need to be protected.


SkyHigh Memory SecureNAND Flash Memory products are available in densities from 1Gb to 4Gb and in the
industry-standard 63-ball BGA package. These products support the ONFI 1.0 NAND interface and include volatile and nonvolatile block protection features.

SLC : 1Gb-8Gb 3.0V [ML-3]

Product Datasheets

Part NumberPage SizeProduct StatusDensityAccess TimePackagingDatasheet
S34ML08G34KBFor New Designs, Production8 Gb25 ns48-pin TSOP, 63 Ball BGA
S34ML08G32KBFor New Designs, Production8 Gb25 ns48-pin TSOP, 63 Ball BGA
S34ML04G34KBFor New Designs, Production4 Gb25 ns48-pin TSOP, 63 Ball BGA
S34ML04G32KBFor New Designs, Production4 Gb25 ns48-pin TSOP, 63 Ball BGA
S34ML02G32KBFor New Designs, Production2 Gb25 ns48-pin TSOP, 63 Ball BGA
S34ML01G32KBSampling Soon1 Gb25 ns48-pin TSOP, 63 Ball BGA

Temperature Range : Industrial (-40°C to +85°C), Industrial Plus (-40°C to +105°C), Automotive AEC-Q100 Grade 3 (-40°C to +85°C), Automotive AEC-Q100 Grade 2 (-40°C to +105°C)


SLC : 1Gb-16Gb 1.8V [MS-2]

Product Datasheets

Part NumberProduct StatusDensityAccess TimePackagingDatasheet
S34MS08G2For New Designs, Production8 Gb45 ns63-Ball BGA
S34MS04G2For New Designs, Production4 Gb45 ns48-pin TSOP, 63-Ball BGA
S34MS02G2For New Designs, Production2 Gb45 ns48-pin TSOP, 63-Ball BGA
S34MS01G2For New Designs, Production1 Gb45 ns48-pin TSOP, 63-Ball BGA, 67-ball


SLC : 1Gb-16Gb 3.0V [ML-2]

Product Datasheets

Part NumberProduct StatusDensityAccess TimePackagingDatasheet
S34ML16G2For New Designs, Production16 Gb25 ns48-pin TSOP, 63-ball BGA
S34ML08G2For New Designs, Production8 Gb25 ns48-pin TSOP, 63-ball BGA
S34ML04G2For New Designs, Production4 Gb25 ns48-pin TSOP, 63-ball BGA
S34ML02G2For New Designs, Production2 Gb25 ns48-pin TSOP, 63-ball BGA
S34ML01G2For New Designs, Production1 Gb25 ns48-pin TSOP, 63-Ball BGA, 67-ball


SLC : 2Gb - 4Gb 1.8V [MS-1]

Product Datasheets


Part Number

Product StatusDensityAccess TimePackagingDatasheet
S34MS04G1Production4 Gb45 ns48-pin TSOP, 63-Ball BGA
S34MS02G1Production2 Gb45 ns48-pin TSOP, 63-Ball BGA


SLC : 2Gb - 8Gb 3.3V [ML-1]

Product Datasheets

Part NumberProduct StatusDensityAccess TimePackagingDatasheet
S34ML08G1Production8 Gb25 ns48-pin TSOP, 63-ball BGA
S34ML04G1Production4 Gb25 ns48-pin TSOP, 63-ball BGA
S34ML02G1Production2 Gb25 ns48-pin TSOP, 63-ball BGA


SLC : 1Gb-4Gb 3.0V [SL]

Product Datasheets

Part NumberProduct StatusDensityAccess TimePackagingDatasheet
S34SL04G2For New Designs, Production4 Gb25 ns63-ball BGA
S34SL02G2For New Designs, Production2 Gb25 ns63-ball BGA
S34SL01G2For New Designs, Production1 Gb25 ns63-Ball BGA


SPI NAND : 1Gb-4Gb 3.0V [ML-3]

Overview

The SkyHigh Memory ML-3 SPI NAND Flash family is offered in 1Gb to 4Gb densities. The family offers products with 3.3V VCC power supply, and x1, x2, x4 I/O interface. The page size is either (2048 + 128 spare) or (2048 + 64 spare) bytes. The bytes of spare area can be used for meta data or parity bits.


The ML-3 SPI NAND Flash family also provides enhanced security features for applications which need the highest security.



SPI NAND : 1Gb-4Gb 3.0V [ML-3]

Product Datasheets

Part NumberPage SizeProduct StatusDensityPackage DescriptionPackage DimensionDatasheet
S35ML04G32KBFor New Designs, Production4 Gb8-pin LGA6 x 8 mm
S35ML02G32KBFor New Designs, Production2 Gb8-pin LGA6 x 8 mm
S35ML01G32KBFor New Designs, Production1 Gb8-pin LGA6 x 8 mm

e.MMC

Overview

“SkyHigh Memory offers a family of e.MMC 5.1 NAND Flash. These e.MMC products provide a highly efficient NAND flash memory, with an integrated controller and enhanced memory management. The e.MMC 51. Product family are offered in Industry standard and small form factor packages.


Our eMMC 5.1 NAND Flash is the optimal solution for large data storage in embedded applications
in the Communication, Consumer, and Industrial Segments.”



e.MMC

Product Datasheets


Part NumberProduct StatusDensityPackage DescriptionPackage DimensionDatasheet
S40FC004Production4 GBFBGA 15311.5 x 13 x 0.8 mm
S40FC004Production4 GBFBGA 1539.0 mm x 7.5 mm x 0.8 mm
S40FC002Production2 GBFBGA 15311.5 x 13 x 0.8 mm
S40FC002Production2 GBFBGA 1539.0 mm x 7.5 mm x 0.8 mm
S40FC008Production8 GBFBGA 15311.5 x 13 x 0.8 mm
S40FC0016Coming Soon16 GB



NAND BASE MCP

Overview

SkyHigh Memory S6 Multi-Chip Package (MCP) product family, provides an integrated solution by stacking in one package 1.8V SLC NAND and 1.8V LPDRAM4xMemory components. This product family is designed for applications that need high reliability and performance with lower power consumption within small form factor.


SkyHigh Memory MCP products is currently available in 8Gb SLC NAND +8Gb LPDDR4x configuration and is offered in small JEDECcompliant 149-ball BGA packages. This benefit becomes more critical in small PCBs for modules and space critical designs particularly for mobile and portable applications.
MCP NAND Product OverviewPDF | 973 KB

NAND Base MCP Products Highlights

SLC NAND

  • Densities : 8Gb IO width: x8

  • Voltages : 1.8V

  • Page Size : 2KB

  • Reliability : 100,000 P/E Cycles 10 years (typical)

  • ECC : 4bit ECC

LPDDR4x

  • Densities : 8Gb IO width: x16

  • Voltages : 1.8V, 1.1V

  • IO : 0.6V

  • Speed : 2133MHz

  • Bandwith : 4266Mb

Temperature

  • -40°C to +85°C

  • -40°C to +105°C

Package

  • 149-ball WFBGA 9.5 x 8 x 0.7 mm

Product Datasheets

Part NumberProduct StatusVoltageDensityI/O BusPackage DimensionDatasheet
SLC NANDDRAMSLC NANDDRAM NAND
S6AA8803Production1.8V8Gb8Gb816WBGA 149
S6AA1616Sampling1.8V16Gb16Gb816WBGA 149



LPDDR4x/LPDDR4

Overview

SkyHigh Memory S60 LPDDR4x and S70 LPDDR4x (Low Power Double Data Rate) memory product family is designed for applications that need high performance with lower power consumption.


Skyhigh Memory LPDDR4 and LPDDR4x product memory support I/O voltage respectively as low as 1.1V and 0.6V and I/O transfer rate as high to 4267 MT/s.


SkyHigh Memory LPDDR4/4x products is currently available in 8Gb and 16Gb and is offered in JEDEC compliant 200-ball BGA packages.

Product Datasheets

FamillyPart NumberProduct StatusDensityPackage DescriptionPackage DimensionDatasheet
LPDDR4xS60A08Production8GbFBGA 20010 mm x 14.5 mm x 0.8 mm
LPDDR4xS60A16Sampling16GbFBGA 20010 mm x 14.5 mm x 0.8 mm









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