 WHY CHOOSE US —— YOUR NEEDS, MY PURPOSE —— PROFESSIONAL & EFFICIENCY QUALITY MANAGEMENT & LOWER COST CERTIFICATE OF CONFORMITY INSPECTION ON PACKING & SHIPPING
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01 02 03 Targeted Customer Groups Benefit from our expertise in serving diverse customer segments, including aerospace, medical, telecommunications, and more. We tailor our approach to meet the unique needs of each industry. Free Enrollment Join our platform effortlessly and at no cost. We welcome small-scale distributors, providing a straightforward onboarding process without financial barriers. IntelligentWarehousing Maximize efficiency with our advanced warehousing system, optimizing inventory management for reduced lead times and seamless order processing. 04 05 Swift Delivery Experience prompt order fulfillment with our streamlined supply chain, ensuring your products reach customers swiftly in the dynamic electronics market. Big Data Precision Matching Leverage our data-driven approach for precise product matching. Our advanced analytics ensure that your offerings align seamlessly with market demands, enhancing your sales success. 16 YEARS FOUCSED ON ELECTRONIC COMPONENTS ALL FOR YOUR BEST EXPERIENCE We can issue third-party laboratory inspection reports according to customer requirements and test a comprehensive range of items. External assessment Failure detection ROHS testing Heating chemical detection Acetone detection X-RAY detection Solderability Testing Electrical performance testing Reliability testing Open cover detection Testing Items Quality Assurance Quality Assurance: 100% Original Strict Inspection: 100% Test Report Bad goods compensation: 100% Full refund Mode of Transport: Fedex DHL UPS: TESTING REPORT INSPECTION ON PACKING & LABEL LABORATORY TESTING PACKING & SHIPPING CERTIFICATE OF CONFORMITY
The article explores Samsung SSDs and modules in detail. It first introduces the general concept and applications of these products. Then it elaborates on different types of Samsung SSDs like M.2, NVM The article explores Kingston modules in detail. It first introduces the basic concept of Kingston modules and then elaborates on different types like SDRAM, DDR, and DDR5. The performance and compati This article offers an in-depth analysis of brand memory modules, including their characteristics, application scenarios, and comparisons among different brands. The article delves into the concept of memory performance, covering its significance, ways to evaluate it, common issues like memory leaks, and strategies for improvement. This article covers various aspects of desktop memory, from different types and their features to methods of upgrading and specific product offerings. The article offers a detailed analysis of laptop memory, covering different brands, capacities, and prices. It also highlights the features and customer reviews of various memory products. This article explores various aspects of server memory in SQL Server, such as its parameters, setting methods, and querying techniques to help users manage and optimize memory usage. This article presents a detailed examination of multiple SSD reviews, highlighting their features, performance, and user experiences This article explores the recent changes and future expectations of SSD prices, covering various factors influencing the market. The article introduces SSD Benchmarks, focusing on the AS SSD Benchmark tool, its functions, test parameters, and significance in evaluating SSD performance. This article offers a comprehensive understanding of memory upgrade, including its significance, types, methods of checking memory, and related products. This guide offers step-by-step instructions for installing SSDs, including preparing tools, choosing the right SSD, and handling common problems. It also emphasizes the importance of proper installati The article explores the relationship between DDR memory and other types of memory, highlighting its advantages, and discussing its impact on computer systems and storage devices. The article explores various aspects of SSD compatibility, including issues with Dell laptops, second SSD installation in Dell and ASUSTOR devices, and solutions for compatibility problems in differen This article explores the concept of high-speed memory, covering various aspects such as its types, applications in different devices, and the latest technological developments in this field. The article explores the top SSD brands, their market shares, and the factors influencing their performance The article explores the differences and similarities between HBM and various other memory types, highlighting their performance, cost, and usage in different fields. The article explores the various aspects of HBM's future development, including its market size, application expansion, technological advancements, and competitive landscape. This article delves into various aspects of SSD capacity, covering details such as maximum installable capacity, capacity conversion, and more This article provides a comprehensive understanding of memory storage, including its types, functions, and differences in computer systems. The article discusses the disadvantages of HBM, including information from various sources This article examines the significant advantages of HBM technology in terms of bandwidth, power consumption, packaging size, and its potential as a mainstream solution. This article explores HBM in computing, including its definition, how it works, its role in AI servers, market growth, and future prospects. The article explores the features, applications, market trends, and differences of HBM technologies, covering aspects such as performance, manufacturing, and market share The article discusses SSD performance in detail, including performance test procedures, important concepts, and reasons for performance changes. It also mentions different SSD brands and their charact This article provides an in-depth analysis of the HBM market, covering its historical trends, current status, major players, application areas, challenges, and future projections Memory chips play a crucial role in digital economy. This article discusses their structure, performance evaluation, and the latest restrictions on their export. The article delves into HBM performance, including its issues in IEC-robust ICs, custom forms by Samsung Electronics, advancements driven by AI, features of HBM3, and future plans for HBM4. The article explores various aspects of memory modules, including their definitions, types, functions, and examples of different models. The article delves into the various aspects of Solid State Drive, comparing it with other types of drives and highlighting its significance in modern computing. The article delves into the concept of memory capacity, covering its definition, types, factors affecting it, and its significance in the field of technology This article provides a comprehensive understanding of the memory interface, covering its components, functions, and applications in different scenarios such as memory chips and microcontrollers. The article offers a comprehensive overview of HBM technology, including its application in mining, advancements in the semiconductor industry, and its growing demand in the market. This article explores the nature, workings, and benefits of SSDs compared to HDDs. It also offers tips on choosing SSDs and recommends some popular models. This article delves into the various aspects of memory access, including its definition, functions in different systems, and importance in computing. The article delves into various memory types, including private, shared, anonymous, and file-backed with swap. It explains their properties and applications in detail. This article offers detailed information about memory devices, including their components, working principles, and various types such as SRAM, DRAM, and ROM. It also discusses their applications in di The article examines the diverse uses and technological aspects of High Bandwidth Memory (HBM), including its circuit design, engineering services, package integration, and access with FPGAs. The article covers various aspects of memory management, from its basic requirements and methods to addressing issues like blue screens and memory leaks. This article delves into various aspects of memory performance, including its assessment parameters, common causes of memory leaks, and ways to optimize it. The article discusses memory optimization techniques including software for monitoring CPU and RAM, register variable allocation in C language, subgraph partitioning, and buffer reuse, among others. This comprehensive guide covers the causes of high memory usage, methods to check memory usage, strategies for optimization, and introduces several effective memory optimization tools. The article discusses different approaches and resources related to memory improvement, including music, exercises, and proven techniques. This article covers HBM's applications in test measurement, industrial control, and the semiconductor industry, as well as its technical features and advantages. The article discusses the importance of effective memory retention and presents research findings and practical methods for enhancing it. It covers topics such as the role of sleep and different study This article provides in-depth insights into the concept of memory storage, differentiates between memory and storage, and explains their roles in computer systems. The article delves into the complex world of memory disorders treatment, offering comprehensive information and potential solutions. The article discusses multiple aspects of memory loss prevention, including age-related changes, scientific research findings, and practical tips for keeping the brain in good shape. The article examines different methods and systems for evaluating memory performance, including those using body sensors, benchmarks for multicore processors, and comparisons between Hadoop and Spark. This article provides comprehensive information on memory capacity expansion, including techniques using memory chips and circuits in data processing systems. This article delves into the diverse aspects of memory technology, covering its applications, advancements, and related components The article discusses the causes and effectiveness of memory training programs in different contexts, such as Alzheimer’s disease and dementia, and examines their impact on working memory. The article delves into the nature of optimal memory strategies, their role in cognitive functions, and how they are utilized in AI and learning. It also provides tips for enhancing memory. The article covers memory optimization methods including software for monitoring CPU and RAM changes, register variable allocation in C language, and various optimization techniques in computing graph The article delves into the concept of memory capacity, covering its definitions, related terms, influencing factors, and applications in different fields. The article presents multiple proven memory improvement techniques, covering aspects such as the Memory Palace, short-term and long-term memory, and practical activities. The article discusses the importance of memory upgrade for enhancing computer performance, different types of updates, and various ways to check memory details and usage. The article covers various aspects of memory management, such as its requirements, virtual memory systems, application-level management, causes of issues like blue screen, and solutions. The article emphasizes the crucial role of memory speed in enhancing computer performance, discusses factors affecting it, and offers practical solutions for improvement. The article presents diverse aspects of memory enhancement, including music, capsules, and language expressions, along with their associated benefits and features. The article delves into the significance of memory chips in the digital economy, discusses different types and how to assess their performance, and examines the latest developments in chip restriction This article delves into the crucial aspects of memory performance in computer systems, covering its components, evaluation metrics, and optimization techniques. The article covers various aspects of memory types, including their classification, features, and usage in different systems. The article discusses different memory solutions from various companies, covering their features, performance, and availability. The article explores the concept of memory expansion, including different methods and its significance in improving computer performance. The article explores various aspects of memory devices, including their structure, operation, and electrical characteristics. It also mentions their use in different systems and devices. The article explores the concept of embedded memory, discusses its role in different systems like ESP32-CAM and STM32, and examines various boot modes and memory characteristics. This article provides a comprehensive understanding of memory storage, including its types, features, and differences between related terms The article delves into the definition, types, influencing factors, and applications of memory capacity, offering valuable insights for readers. The article explores the concept of memory speed, offers methods to check it on different operating systems, and discusses ways to enhance it for improved system performance. This article explores the various aspects of solid-state memory, from its basic definition and types to its wide range of applications and the continuous advancements in the field. This article explains the evolution of DDR memory from SDRAM, describes its various types and their characteristics, and offers guidance on how to select the right DDR memory for different needs. The article delves into various aspects of high-performance memory, including its intrinsic mechanisms, role in different systems, and recent advancements like CXL and GDDR6. The article discusses the importance of memory upgrade for improving computer performance, different types of updates, and how to check memory details on different operating systems. This article delves into the various aspects of memory storage, including its types, functions, and differences in computer systems. This article provides detailed information about the memory module, including its structure, working principle, and various related aspects. This article offers a comprehensive exploration of memory chips, including their structure, types, application scenarios, as well as the latest industry developments and regulatory measures. The article delves into the world of memory cards, explaining their functionality, uses in different electronics, and factors to consider when choosing one. The article delves into the applications of Magnetoresistive Random-Access Memory (MRAM) in multiple industries. It highlights how MRAM meets the specific requirements of each application, such as hig The article explores NETSOL's Asynchronous SRAM, including its key features like broad density, power supply flexibility, and ECC support. It also details the product range with different densities, a Netsol offers KGD products in wafer form. These products simplify system design and reduce device dimensions. They have equivalent quality and performance to discrete products. All SRAM products are a The article focuses on Netsol's Wafer Biz, highlighting its KGD products. These products are in wafer form and offer advantages to chipset vendors for SiP solutions. They have equivalent quality to di NETSOL's Parallel STT - MRAM products are ideal for applications needing quick and frequent data storage and retrieval. They possess features like non - volatility, high endurance, and fast - write ca The article delves into NETSOL's Serial STT - MRAM products. It first explains the advantages of STT - MRAM technology. Then, it details the product lineup with different densities, including their fe The industrial and automotive grade LPDDR5/5X offers capacity coverage from 4GB to 8GB in a 315-ball standard FBGA packaging. It has features like high bandwidth, low power consumption, high reliabili The article focuses on a UFS product with a self - developed UFS 2.2 controller chip, LDPC 3.0 ECC error - correction engine, and large capacity. It details the product parameters, characteristics lik The Industrial and Automotive Grade eMMC is compatible with JEDEC eMMC5.1, has self-developed components, and offers a range of specifications. It features high reliability, durability, and more. It f The industrial and automotive grade LPDDR4/4X offers a wide capacity range, high performance, and various features like high reliability and wide temperature tolerance. It has multiple models with dif The article focuses on eMMC products that are compatible with JEDEC eMMC5.1, have self-developed controllers and firmware, offer various capacities, and are highly compatible with mainstream platforms The article delves into the remarkable features of LPDDR4/4X, including high data transmission rates, low power consumption, and more. It also examines its diverse application areas, such as mobile de The article delves into Jingcun's SSD products. It first introduces the concept of SSDs and how Jingcun uses 3D NAND technology. Then it details various SSD product lines, their features and performan The article delves into DRAM memory modules, discussing the characteristics of DDR5 and DDR4 modules, such as their frequencies and voltage requirements. It also elaborates on the product line's multi The article focuses on Jingcun's consumer - grade embedded storage. It first introduces the various products in the series such as DRAM and flash products. Then, it elaborates on the product line adva The article reports on the widespread adoption of DeepSeek by 20 global tech companies. International giants like AMD, Microsoft, etc. and numerous domestic enterprises have all incorporated DeepSeek DeepSeek's low - cost AI model expands AI application scenarios, increasing data center construction. This drives the demand for optical transceiver modules, with shipments expected to grow significan The article discusses how DeepSeek's new models are influencing the AI industry. It mentions the growth of the AI Server market, the challenges of cost and efficiency in the AI industry, and how DeepS The article focuses on DeepSeek's login methods which include various options such as phone number and WeChat login. It emphasizes the importance of users agreeing to the Terms of Use and Privacy Poli The article explores the recent trends in the global semiconductor and related industries. It covers price movements, major investments like SK Hynix's large-scale investment in HBM, technological bre The article details the price fluctuations, demand status, and market dynamics in the storage spot market. It shows that prices of SSDs and memory modules have been declining, demand remains weak, and The article comprehensively explores different elements within the domain of integrated circuits. It explains the functions and significance of various components and concepts, highlighting their role 8GB? 16GB? 32GB? 64GB? 128GB?!! We just can’t seem to get enough. With better cameras and displays – which mean more selfies, bigger pictures and more videos – memory has been a growing priority wh... DDR5 is short for “DDR-SDRAM 5” which means “Double Data Rate Synchronous Dynamic Random Access Memory generation 5”. It’s the fifth iteration of a RAM technology that uses both rising and descendi... LPDDR (Low Power Double Data Rate) RAM is a type of mobile DRAM (dynamic random-access memory) that is commonly used in smartphones, tablets, and other mobile devices. It is designed to be power-ef... ContentsRAM Flash memoryFor a smartphone, any component can affect the overall performance and experience of the phone, processor, memory, flash, screen, and more. However, for the novice users who... 1. NAND FlashThe full name of NAND Flash is Flash Memory, which belongs to a non-volatile memory device (Non-volatile Memory Device). It is based on a floating gate transistor design, and charges a... Macronix offers an extensive line of 5V and 3V industry-standard Parallel NOR Flash memory products from 2Mb to 1Gb densities. These products feature Boot and Uniform Sector architectures in x8, x1... Macronix SLC NAND Flash complements its world-leading Serial and Parallel NOR Flash offerings. Our rigorous quality management system ensures that Macronix SLC NAND is one of the most robust and re... As embedded systems evolve, there are many applications with a Serial Peripheral Interface (SPI) that require higher-density memory solutions to store large image files. Recognizing such applicatio... Macronix designs and manufactures 3V, 2.5V and 1.8V Serial NOR Flash products from 512Kb to 2Gb. We also offer backward-compatible, high-performance Serial NOR Flash, MXSMIO® (Multi-I/O) family and... RAW SLC NAND Flash Memory for OEM & IndustrialSLC: A Reliable, High-Performing ChoiceA 1-bit per cell, non-volatile memory, KIOXIA SLC (single-level cell) NAND flash memory writes large amounts of ... Serial Interface NAND Flash Memory for OEM & IndustrialSerial Interface NAND Flash Memory: A High-Speed SPI Alternative to NOR Flash MemoryKIOXIA Serial Interface NAND flash memory features a seria... Consumer Grade e-MMC SpecsCapacityPart Numbere-MMC VersionMax Data Rate(MB/s)Supply VoltageOperating Temperature(℃)Package Size(mm)VCC (V)VCCQ (V)4GBTHGBMNG5D1LBAIT5.04002.7 to 3.61.70 to 1.95,2.7 ... UFS 4.0 SpecsCapacityPart NumberUFSVersionMax DataRate(MB/s)Supply VoltageOperatingTemperature(℃)Package Size(mm)VCC(V)VCCQ(V)VCCQ2(V)128GBTHGJFJT0E25BAIP4.046402.4 to 2.71.14 to 1.26- (1)-25 to 85... CapacityPart NumberUFSVersionMax DataRate(MB/s)Supply VoltageOperatingTemperature(℃)Package Size(mm)VCC(V)VCCQ(V)VCCQ2(V)32GBTHGAF8G8T23BAIL2.111602.7 to 3.6- (1)1.70 to 1.95-25 to 8511.5x13.0x0.86... Rayson Technology Ltd.RAYSON HI-TECH(SZ) LIMITED was founded in 2016. It is a high-tech enterprise of memory chip integrated with design, research & development, package, testing and marketing.Head... 64 RaysonDDR4Package：FBGA 96bDensity：2Gbit~8GbitOperating Temperature Range：0~85℃Speed：2400Mbps/2667MbpsVoltage：1.2VApproved Verification Platform：MTK、Spreadtrum、Rockchip、Amlogic● Speed up to 2667Mbps... 35 RaysonDDR3Package：FBGA 96bDensity：128*16/256*16/512*16Operating Temperature Range：0~85℃Speed：1866MbpsVoltage：1.35 / 1.5 VApproved Verification Platform：MTK、Spreadtrum、Rockchip、Amlogic● Higher exter... RaysonLPDDR4/4XPackage：FBGA 200bDensity：4Gbit~64GbitOperating Temperature Range：-25~85℃Speed：2667Mbps/3200Mbps/3733MbpsVoltage：VDD1/VDD2/VDDQ= 1.8 / 1.1 / 1.1 V（LPDDR4）VDD1/VDD2/VDDQ = 1.8 / 1.1 / ... MT40A8G4CLU-062H:Edownload32Gb95CTFBGADDR4 SDRAMMT40A2G4SA-062E:Rdownload8Gb0C to +95CTFBGADDR4 SDRAMMT40A4G4VA-062E:Bdownload16Gb0C to +95CTFBGADDR4 SDRAMMT40A1G8SA-062E AAT:Edownload8Gb-40C to +1... 101 MT62F3G32D8DV-026 AAT:Bdownload98Gb3750MHz-40C to +105C3G X32LFBGALPDDR5MT62F1G32D2DS-020 WT:Cdownload32Gb4800MHz-25C to +85C1G X32TFBGALPDDR5MT62F512M64D4EK-031 IT:Bdownload32Gb3200MHz-40C to +95C... Part No.NAND ModeDRAM ModeNAND DensityDRAM DensityProduct StatusH9HP52AECMMDAR-KMMeMMC5.1LPDDR4X64GB6GBMPH9HP53AECMMDAR-KMMeMMC5.1LPDDR4X64GB6GBMPH9AG9G5ANBX100eMMC5.1LPDDR4X64GB4GBMPH9HP52ACPMADAR... Part No.NAND ModeDRAM ModeNAND DensityDRAM DensityProduct StatusH9HQ54AECMMDAR-KEMUFS2.2LPDDR4X64GB6GBMPH9HQ54ACPMMDAR-KEMUFS2.2LPDDR4X64GB4GBMPH9HQ54ADKMMDAR-KEMUFS2.2LPDDR4X64GB3GBCSH9HQ53AECMMDA... table for product spec finderPart No.Model NameDensityProduct GradeTemperatureVoltage(VCC/VCCQ)PKG TypeProduct StatusH26M78208CMRNEE510A64GBCT-25~85C3.3V / 1.8VFBGAMPH26M78208CMRIEE510A64GBIT-40~85... Part No.Model NameDensityMono-DensityPKG SizePKG TypeSpecVoltage(VCC/VCCQ)Product StatusHN8T25BZGKX017NUC310512GB512Gb11.5x13x1.0mmFBGAUFS 3.12.5V / 1.2VMPHN8T15BZGKX016NUC310256GB512Gb11.5x13x1.0m... Part No.DensityVoltage (VDD1 / VDD2 / VDDQ)SpeedPackageProduct StatusH9HCNNNFAMMLXR-NEI8GB1.8V / 1.1V / 0.6V4266Mbps200BallMPH9HCNNNFAMMLXR-NEE8GB1.8V / 1.1V / 0.6V4266Mbps200BallMPH9HCNNNCPMMLXR-N... Part No.DensityVoltage (VDD1 / VDD2 / VDDQ)SpeedPackageProduct StatusH58G66MK6BX0268GB1.8V / 1.05V / 0.5V6400Mbps441BallCSH9JCNNNCP3MLYR-N6E4GB1.8V / 1.05V / 0.5V6400Mbps315BallCSH58G56AK6JX0324GB1... Part No.DensityOrganizationSpeedPackageProduct StatusH5TQ4G63EFR-TEN4Gbx162133MbpsFBGAMPH5TC4G63EFR-TEN4Gbx162133MbpsFBGAMPH5TC4G63EFR-RDN4Gbx161866MbpsFBGAMPH5TQ4G63EFR-RDN4Gbx161866MbpsFBGAMPH5TQ... Part No.DensityOrganizationSpeedPackageProduct StatusH5ANBG6NAMR-XNC32Gbx163200MbpsFBGAMPH5ANBG8NABR-XNC32Gbx83200MbpsFBGAMPH5ANAG6NCJR-XNC16Gbx163200MbpsFCBGAMPH5ANAG6NCMR-XNI16Gbx163200MbpsFBGAMP... Part No.DensityOrganizationSpeedPackageProduct StatusH5ANBG6NAMR-XNC32Gbx163200MbpsFBGAMPH5ANBG6NAMR-WMC32Gbx162933MbpsFBGAMPH5ANBG6NAMR-VKC32Gbx162666MbpsFBGAMPH5ANBG8NABR-XNC32Gbx83200MbpsFBGAMPH... 6 KGD DRAMPieceMakers Technology is devoted to offer a variety of DRAM KGD solutions that are compliant with the JEDEC standard. We are here to help customers make System-In-Package and Multiple-Chip... GigaDevice offers Known Good Die (KGD) products in addition to the standard packaged Flash Memory products. KGD memory is the preferred option for chipset vendors to provide System-in-Package (SiP)... Part NumberVersionCapacityVoltageInterfacePackage SizeTemperatureProduct StatusKLUCG4J1ZD-C0CQKLUCG4J1ZD-C0CQUFS 2.164 GB1.8 / 3.3 VG3 2Lane11.5 x 13 x 1.2 mm-40 ~ 105 °CMass ProductionKLUBG4G1ZF-C... Part NumberVersionCapacityVoltageInterfacePackage SizeTemperatureProduct StatusKLUDG4UHGC-B0E1KLUDG4UHGC-B0E1UFS 3.1128 GB1.2 / 2.5 VG4 2Lane11 x 13 x 0.8 mm-25 ~ 85 °CMass ProductionKLUEG4RHGB-B0E... Part NumberVersionDensityVoltageInterfacePackage SizeTemperatureProduct StatusKLMCG1RCTE-B041KLMCG1RCTE-B041eMMC 5.164 GB1.8 / 3.3 VHS40011.5 x 13 x 0.8 mm-25 ~ 85 °CMass ProductionKLMDG2RCTE-B041K... Part NumberDensityOrganizationSpeedVoltageTemperaturePackageProduct StatusK4B4G0846E-BCNBK4B4G0846E-BCNB4 Gb512M x 82133 Mbps1.5 V0 ~ 85 °C78 FBGAMass ProductionK4B4G1646E-BCNBK4B4G1646E-BCNB4 Gb51... Part NumberDensityOrganizationSpeedVoltageTemperaturePackageProduct StatusK4A8G085WG-BCWEK4A8G085WG-BCWE8 Gb1G x 83200 Mbps1.2 V0 ~ 85 °C78 FBGAMass ProductionK4A8G165WG-BCWEK4A8G165WG-BCWE8 Gb512M... Part NumberDensityOrganizationSpeedVoltageTemperaturePackageProduct StatusK4F6E3S4HB-KFCLK4F6E3S4HB-KFCL16 Gbx324266 Mbps1.8 / 1.1 / 1.1 V-40 ~ 95 °C200 FBGAMass ProductionK4F6E3S4HB-KHCLK4F6E3S4HB... Part NumberDensityOrganizationSpeedVoltageTemperaturePackageProduct StatusK4U6E3S4AB-KFCLK4U6E3S4AB-KFCL16 Gbx324266 Mbps1.8 / 1.1 / 0.6 V-40 ~ 95 °C200 FBGAMass ProductionK4UJE3D4AA-KUCLK4UJE3D4AA... Part NumberDensityOrganizationSpeedVoltageTemperaturePackageProduct StatusK3LK4K40CM-BGCPK3LK4K40CM-BGCP96 Gbx646400 Mbps1.8 / 1.05 / 0.9 / 0.5 V-25 ~ 85 °C496 FBGAMass ProductionK3LKBKB0BM-MGCPK3L... Part NumberDensityOrganizationSpeedVoltageTemperaturePackageProduct StatusK3KL3L30DM-BGCUK3KL3L30DM-BGCU64 Gbx648533 Mbps1.8 / 1.05 / 0.9 / 0.5 V-25 ~ 85 °C496 FBGAMass ProductionK3KL4L40EM-BGCUK3K... K3KL8L80CM-MGCTPioneering premium low-power DRAMWith speeds 1.3 times faster than the previous generation and 20% better power efficiency,premium low-power DRAM LPDDR5X is going beyond mobile - lea... K3KL9L90CM-MGCTPioneering premium low-power DRAMWith speeds 1.3 times faster than the previous generation and 20% better power efficiency,premium low-power DRAM LPDDR5X is going beyond mobile - lea... Pioneering premium low-power DRAMWith speeds 1.3 times faster than the previous generation and 20% better power efficiency,premium low-power DRAM LPDDR5X is going beyond mobile - leading the low-po... On November28 2023, CXMT announced the launch of several LPDDR5 products, including 12Gb LPDDR5 dies, 6GB DSC packaging LPDDR5 mobile DRAM, and 12GB POP packaging LPDDR5 mobile DRAM. The 12GB LPDDR... Quality managementQuality Policy: To become customers’1st choice of semiconductor memory solution provider with key contribution from quality.Smart manufacturing managementCXMT has been enhancing t... LPDDR5The LPDDR5 is the fifth generation of low-power double data rate synchronous dynamic random access memory. The new product offers a single-die density of 12Gb, with a speed of 6400Mbps, repre... Solution OverviewHome Oxygen Concentrator Solution Based on GD32 MCUMost of the home oxygen generators on the market are molecular sieve oxygen generators, which are characterized by low cost, ease... Solution OverviewHigh-performance IP Camera Solution Based on GD SPI NORIn the application scenarios of IP Camera and mobile IP Camera, the demand for low power consumption and fast start up has ap... Solution OverviewThe GigaDevice lineup of fingerprint solution is optimal for PC integration, assisting device unlocking, logging in to services and apps, or verifying payments. Our biometric solut... In the automotive field, electronic components need to meet the requirements of the more stringent AEC-Q100 standard. With GD25/55 SPI NOR Flash and GD5F SPI NAND Flash being AEC-Q100 qualified, Gi... AutomotiveThe need for fast, endurant, non-volatile solutions for automotive that can meet the harsh requirements of automotive conditions has been growing. Automotive applications place severe dem... Enterprise Data Storage (RAID system)RAID (Redundant Array of Inexpensive Disks) is a data storage structure of combining two or more physical storage devices (HDDs, SSDs) into a logical unit (an a... Medical DevicesPortable ultrasound scanner detects the reflected sound waves from objects and turns them into real time images. It normally uses two memories : configuration memory and image/report... Gaming MachinesGaming machines such as a slot machine and a Pachinko machine normally use battery-backed SRAM to store runtime processing data, machine states, configuration data and critical data ... Data LoggingData Logging is a process of collecting and storing critical data over time.The data is regarding :– Events for tracking– History of usage– Environmental parameters– Status of machine– ... IndustrialIndustrial applications normally require the prevention of data loss in harsh operating environments and long data retention. It also needs to ensure the data is backed-up quickly and saf... Smart meterSmart meters provide utilities with accurate, real-time monitoring of energy. The data from smart meters is often transmitted over a variety of wireless networks. Using this real-time da... The future of mobility is coming. Thanks to our innovative portfolio of automotive semiconductor solutions, Samsung Semiconductor is uniquely positioned to collaborate with our automotive industry ... 12 News Highlights9.6Gbps product verified to be compatible with Qualcomm’s new Snapdragon mobile processorWith validation with global major partners completed, SK hynix to provide LPDDR5T to global s... News HighlightsStarts supplying 16 GB mobile DRAM package to global smartphone makersLPDDR5T to be adopted in the latest smartphones along with MediaTek Dimensity 9300 mobile processor“Company to c...
SK hynix Develops World’s Best Performing HBM3E, Provides Samples to Customer for Performance Evalua
9News HighlightsProduct to drive AI tech innovation with industry’s top performance to be produced in volume from 1H24Launch of HBM3E to solidify SK hynix’s unrivaled leadership in AI memory market ... SK hynix’s executive team just got younger. As part of efforts to foster young leadership, Lee Donghun was appointed to the N-S Committee1 at the end of 2023 to become SK hynix’s youngest-ever exec... Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that Qualcomm Technologies, Inc. has validated Samsung's 14-nanometer (nm) based 16-gigabit (Gb) Low P... Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that its latest LPDDR5X DRAM with the industry’s fastest speed of 8.5 gigabits per second (Gbps) was v... Samsung Electronics Co. Ltd., a world leader in advanced memory technology, today announced the release of SSD 990 EVO — the newest addition to the company’s lineup of consumer SSDs — which deliver... Samsung’s PCIe 5.0 SSD will provide nearly two times faster data transfer speeds and 30% enhanced power efficiency than the previous generation, resulting in lower server operating costs*Undergoing... Micron Technology, Inc., announced two new Crucial Pro Series products with the addition of overclocking-capable memory and the world's fastest Gen 5 SSD. The Crucial DDR5 Pro Memory: Overclocking ... Micron Technology, Inc. announced it is appointing Michael Ray as the company’s senior vice president, chief legal officer and corporate secretary effective immediately.In this role, Ray will repor... Samsung Electronics announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date.Samsung’s HBM3E 12H provides an all-time high ba... AI服务器浪潮席卷全球，带动AI加速芯片需求。DRAM关键性产品HBM异军突起，成为了半导体下行周期中逆势增长的风景线。业界认为，HBM是加速未来AI技术发展的关键科技之一。近期，HBM市场动静不断。先是SK海力士、美光科技存储两大厂释出2024年HBM产能售罄。与此同时，HBM技术再突破、大客户发生变动、被划进国家战略技术之一...一时间全球目光再度聚焦于HBM。1HBM：三分天下HBM（... 韩国媒体 TheElec报道，三星正在考虑在其下一代 DRAM 中应用模压填充（MUF）技术。三星最近测试了一种用于 3D 堆栈 (3DS) 存储器的MUF 技术，与 TC NCF 相较其传输量有所提升。据悉，MUF 是一种在半导体上打上数千个微小的孔，然后将上下层半导体连接的硅穿孔 (TSV) 技术后，注入到半导体之间的材料，它的作用是将垂直堆栈的多个半导体牢固地固定并连接起来。而经过测试... 近期，存储厂商南亚科总经理李培瑛对外表示，HBM目前产品溢价较高，确实会对存储器厂商营收有所贡献，但其占全球DRAM位元数仅约2%。因此，以当前南亚科在DRAM市场的市占率而言，现阶段不适合公司投入大量资源争夺HBM市场。存储市场正掀起AI狂欢热潮，HBM技术也从幕后走向台前，并成为推动存储器产业发展的强劲动能。不过，HBM技术含量高、在DRAM占比小，因此决定了该技术是属于三星、SK海力士... 我们先从一片完整的晶圆（Wafer）说起：一块完整的wafer名词解释：wafer 即为图片所示的晶圆，由纯硅（Si）构成。一般分为6英寸、8英寸、12英寸规格不等，晶片就是基于这个wafer上生产出来的。Wafer上的一个小块，就是一个晶片晶圆体，学名die，封装后就成为一个颗粒。一片载有Nand Flash晶圆的wafer，wafer首先经过切割，然后测试，将完好的、稳定的、足容量的di... 定义：中文名为绝缘栅双极型晶体管，是由BJT(双极型三极管)和MOS(绝缘栅型场效应管)组成的复合全控型电压驱动式功率半导体器件,结合了MOSFET的高电流单栅控制特性和BJT的低饱和电压能力。IGBT按封装划分可以分为单管分立器件、IGBT模块和IPM。通常市场上讲的IGBT指的是IGBT模块。特点：IGBT是能源转换与传输的核心器件，是电力电子装置的“CPU”，具有高压、大电流、高速三大... 日常选机大家往往关注64GB、128GB等存储空间，却很少像选笔记本关注SSD一样关注手机闪存规格。首先手机储存容量、固态硬盘（SSD）、U盘和SD卡等使用的都是一种叫做NAND的储存介质，NAND闪存是一种非易失性存储技术，即断电后仍能保存数据。它的发展目标就是降低每比特存储成本、提高存储容量。 无论是eMMC还是UFS都是在NAND存储芯片的基础上，再加上了控制芯片，接入标准接口，进行... 一、NAND FlashNAND Flash全名为Flash Memory，属于非易失性存储设备(Non-volatile Memory Device)，基于浮栅(Floating Gate)晶体管设计，通过浮栅来锁存电荷，由于浮栅是电隔离的，所以即使在去除电压之后，到达栅极的电子也会被捕获。这就是闪存非易失性的原理所在。数据存储在这类设备中，即使断电也不会丢失。根据不同的纳米技术，NAND... LPDDR5BIWIN LPDDR5LPDDR5支持多Bank Group模式，传输速率从4266Mbps提升至6400Mbps，多组电压动态调节，功耗降低30%；高性能、低功耗、更安全可靠和多容量选择，佰维LPDDR5内存方案将有效满足中高端智能手机、平板电脑、汽车等各种智能终端对内存芯片的需求。产品规格InterfaceLPDDR5Dimension12.4×15.0mmFrequenc... BIWIN LPDDR4LPDDR4LPDDR全称是Low Power Double Data Rate SDRAM，是DDR的一种，主要以低功耗为特点。BIWIN Low Power DDR提供包括从高性能到高性价比的RAM解决方案。最新一代的LPDDR4具有比LPDDR3高50%的性能提升；同时，更低的功耗和更高的频率，让设备运行更加顺畅。产品规格InterfaceLPDDR 4 / L... eMCP随着手机所用操作系统的程序代码容量变大，特别是随着Android操作系统的广泛流行，智能型手机对存储容量的更高要求，BIWIN eMCP是基于MCP(Multi-Chip Packaging；多芯片封装技术)的产品，采用eMMC芯片加一颗低功耗的DRAM方案，有效简化了客户产品的制造过程和开发成本，缩短终端产品的研发时间，加快终端产品上市。产品规格接口eMMC+LPDDR4X尺寸11... BIWIN eMMCBIWIN eMMC凭借简练和先进的设计在短时间内进入市场，采用高性能主控芯片和稳定的NAND Flash，可在提高数据传输效率的同时，更稳定地实现更多、更快的多任务处理，可保证网页浏览、下载应用程序、高清视频回放、运行大型游戏时的流畅性。eMMC的一个明显优势是在封装中集成了一个控制器，它提供标准接口并管理闪存，使得设备厂商能专注于产品开发的其它部分，并缩短向市场推出产... 康芯威-KONSEMI_国产EMMC嵌入式存储芯片合肥康芯威存储技术有限公司(以下简称“康芯威”)成立于2018年11月,主营业务为“前沿存储技术开发、方案输出、芯片设计、半导体器件分销”,产品应用于电视、机顶盒、手机、智能汽车、数据中心等领域前沿存储技术开发方案输出芯片设计生产与销售eMMC5.1：产品介绍： 支持8GB至128GB，主要应用于手机、平板电脑、电视、机顶盒、智能穿戴、... SWM34S概述- 内核：安谋科技“星辰”STAR-MC1内核，最高工作频率 150MHz- Flash: 512KB, SRAM: 64KB- SDRAM: 2MB, 8MB, 16MB- 1个RGB565接口(64Pin)，1个RGB888接口(100Pin)- JPEG硬件解码器，DMA2D- USB OTG*1, I2C*2, SPI*2, UART*4, I2S*2, CAN*2,... 最近有很多客户在使用 SD NAND的时候都会问SD NAND与SPI NAND有什么区别，下面我们来一起了解下内部材质：主流SD NAND与SPI NAND基本上都是使用SLC NAND FLASH晶圆，擦写寿命可达5万-10万次；接口以及驱动程序：SD NAND正常接CPU是用SDIO接口，SPI NAND是接SPI接口使用，很多主流的CPU都是自带SDIO的驱动，因此使用SD NAND... MRAM是一种非易失性存储技术，通过磁致电阻的变化来表示二进制中的0和1，从而实现数据的存储。由于产品本身具备非易失性，让其在断电情况下依然可以保留数据信息，并拥有不逊色于DRAM内存的容量密度和使用寿命，平均能耗也远低于DRAM。被大厂看好的未来之星，非它莫属。01 三星：新里程碑目前三星仍然是全球专利*，2002年三星宣布研发MRAM，2005年三星率先研究STT-MRAM，但是此后的十... AI如何在数以百亿的小算力MCU嵌入式应用中落地？海思正在给出自己的答案。海思A²MCU聚焦行业专用（Application Specific）和嵌入式AI技术（Artificial Intelligence），将AI领域超轻量级的技术框架、极致性能的推理要求、方便快速的部署能力与MCU深度融合，为MCU行业客户探索智能化应用提供新的选择。在TCL小蓝翼P7新风空调发布会上，海思与TCL空调... 在12月16日举行的2023年openEuler峰会上，上海海思推出了支持openEuler系统的A²MCU解决方案。海思表示，A²针对家电、能源、工业、汽车等领域推出，不仅涵盖基于RISC-V的系列化MCU，还包含兼容ARM指令集的高性能MPU，以及与之紧密配合并优化的操作系统。可以说，该方案的推出对日益扩大的AIoT形成了更加完备的支持。人们大多知道，华为海思有“大海思”和“小海思”之分... SD NANDSD NAND是储存卡的延伸，可直接贴片，又名贴片式TF卡、SD Flash 等，其内部集成高性能的闪存控制器，兼容 SD 协议，满足客户小型化、差异化、高可靠性的设计需求。SD NANDSD NAND是储存卡的延伸，可直接贴片，又名贴片式TF卡、SD Flash 等，其内部集成高性能的闪存控制器，兼容 SD 协议，满足客户小型化、差异化、高可靠性的设计需求。产品优势：小尺寸：... HBM竞争格局与应用市场：三巨头垄断，受益于AI服务器市场增长。据TrendForce集邦咨询研究显示，2022年三大原厂HBM市占率分别为SK 海力士（SK hynix）50%、三星（Samsung）约40%、美光（Micron）约10%。新思界预测2025E中国HBM需求量将超过100万颗。JEDEC定义三类DRAM标准：HBM属于细分图形DDR下述三种 DRAM 类别使用相同的 DRA... 由于处理器与存储器的工艺、封装、需求的不同，从1980年开始至今二者之间的性能差距越来大。有数据显示，处理器和存储器的速度失配以每年50%的速率增加。存储器数据访问速度跟不上处理器的数据处理速度，数据传输就像处在一个巨大的漏斗之中，不管处理器灌进去多少，存储器都只能“细水长流”。两者之间数据交换通路窄以及由此引发的高能耗两大难题，在存储与运算之间筑起了一道“内存墙”。着数据的爆 炸势增长，内... 57 HBM4将是未来市场上最先进的存储器。HBM技术是一种基于3D堆叠工艺的高性能DRAM，它可以为高性能计算、人工智能、数据中心等领域提供高带宽、高容量、低延迟和低功耗的存储解决方案。本文将介绍HBM技术的原理、优势、应用和发展趋势。01. HBM技术原理： 3D堆叠实现高密度存储HBM技术是一种将多层DRAM芯片通过硅通孔（TSV）和微型凸点（uBump）连接在一起，形成一个存储堆栈（sta...
Samsung Electronics Launches Industry’s First 24Gbps GDDR6 DRAM to Power Next-Generation High-End Gr
48Incorporating an innovative circuit design and advanced insulating material,Samsung’s new memory will be the first GDDR6 to deliver speeds up to 24GbpsCompliant with the latest GDDR industry standa... GDDR6X: Bringing Gaming and AI to LifeMicron has created the world’s fastest discrete graphics memory solution: GDDR6X. Launched with NVIDIA on the GeForce® RTX™ 3090 and GeForce® RTX™ 3080 GPUs, G... 具有高级安全功能的新3.0V 1Gb-4Gb容量2KB/4KB页第一代串口（SPI）NAND和1Gb-2Gb容量2KB页第三代并行系列NAND，ML-3产品新州圣页何塞，20日20日——全球存储存储解决方案的领导者天海存储（SkyHigh Memory Limited）向市场推出其NAND系列3.0V 1Gb-4Gb容量4KB和2KB页ML3-产品。新的Gb-4Gb ML的3 SLC 1nm... 拉曼光谱仪，红外光谱仪，光纤光谱仪等检测设备，现有产品SRAM以ISSI 16Mb异步快速为主；推荐了NETSOL 最新新型存储MRAM产品，Parallel STT-MRAM 系列Netsol的 Parallel STT-MRAM 具有非易失特性和几乎无限的耐用性。对于需要快速存储和搜索数据和程序的应用程序来说，这是最理想的内存。 适用于工业设备中的代码存储、数据记录、备份和工作存储器。可... 为了实现这些关键功能，助听器利用声音处理器来解释多个音频频率和级别。由助听器麦克风捕捉到的声音波被发送到处理器，将信号转换为数字信息，然后增强并放大给佩戴者。为了实现最佳听觉效果，处理器根据不同的用户情境或环境决定要增强或减弱哪些音频频率。此外，为了使处理器能够解释的声音必须以对耳朵来说无法察觉的声音延迟重新传输。 对于听觉和通信助听器中的多个程序的操作，非易失性存储器所... STT-MRAM已成为最受关注的新一代存储半导体技术之一。该产品使用了可通过Spin-Torque传递转换的两种稳定的磁化状态(Magnetic State)，使处理速度非常快，耐久性也非常出色。MRAM利用磁性来维持数据，因此即使不提供额外的电力，数据也能维持，电力消耗较少，器件的尺寸也非常小，因此可以制造出比现在更高密度的半导体。另外，由于只改变物质磁性的方向，半导体的耐久性好，储存和读... 智能电表通过多种有线和无线网络传输电表数据，使电力公司能够准确地实时监控电力使用情况。电力公司通过这样的实时数据，监控使用量，检测异常情况，从而提高效率并降低成本。由于智能电表需要连续记录数据，因此需要高耐用性的内存。此外，随着OTA（Over The Air：通过无线通信进行S/W升级）功能的加入，内存的快速写入速度变得更加重要。MRAM是最理想的存储器，能够同时满足智能电表对高耐久性和快... # MRAM 晶圆Netsol的KGD 内存产品具有与单独产品相同的质量及性能特征。两种类型的产品皆在使用相同的生产和测试程序进行严格验证后获得认证。* 所有 SPIMRAM和PPIMRAM产品都以KGD选项交付。* 专门技术支持团队支持KGD客户的特定需求 RAID（Redundant Array of Inexpensive Disks）是一种结合了两个或多个物理存储设备（HDD、SSD）的数据存储结构，它在被连接的系统中，被转换成识别为单个驱动器的逻辑单元（阵列）。 RAID控制卡的日志存储器存放重要数据，如日志和数据写入完成、奇偶校验写入、错误日志等。在断电的情况下，控制器查询日志内存，以了解从哪里开始恢复。MRAM中存储的主要是系统元数... Netsol的KGD 内存产品具有与单独产品相同的质量及性能特征。两种类型的产品皆在使用相同的生产和测试程序进行严格验证后获得认证。* 所有 SPIMRAM和PPIMRAM产品都以KGD选项交付。* 专门技术支持团队支持KGD客户的特定需求 物联网 (IoT) 将众多智能设备利用互联网协议技术连接起来，使它们能够相互通信。MRAM持久性，结合极低的能耗模式，使物联网节点的代码和数据能够在极小的形状因素下从能源收割机或电池源操作。启动时间通常是物联网节点的一个重要考虑因素。MRAM利用原地算法（code-in-place）结构可减少所需的启动时间，由于对DRAM或SRAM的需求更少，所以减少了总体材料清单成本。从物联网的应用程序来... 弹珠机和老虎机等游戏机通常使用电池供电的SRAM来存储运行时处理数据、机器状态、配置数据和重要数据（赔率、乘数、游戏单词的比赛记录）。这些数据即使在突然停电时，也必须安全存储。MRAM作为非易失性安全存储，用于游戏机的电源冲击和ESD耐受。# MRAM 晶圆Netsol的KGD 内存产品具有与单独产品相同的质量及性能特征。两种类型的产品皆在使用相同的生产和测试程序进行严格验证后获得认证。* ... 汽车通信与连接性：MRAM的快速响应与稳定性MRAM具有近乎无限的耐久性及高可靠性，是能够满足电子应用程序中这种市场需求的非易失性存储器，最为理想。MRAM的主要优势如下· 近乎无限的耐用性（100兆次的写入次数）·长期数据保存（10 年）·快速写入时间·高可靠性·高放射线耐性# Serial STT-MRAM 串口容量 : 1Mb、2Mb、4Mb、8Mb、16Mb、32Mb 电源供应 ：... 11 品牌的磁性随机访问存储器（MRAM）与其他存储技术相比具有许多独特的特点和优势。以下是MRAM与其他存储技术（如闪存、DRAM、NVRAM等）进行比较的一些方面：∎ 更快的写入速度：MRAM芯片比FRAM芯片具有更快的写入速度。MRAM芯片可以实现单个字节的写入，而FRAM芯片则需要写入整个数据块。这使得MRAM芯片在存储大量数据时更加高效。更低的功耗：MRAM芯片比FRAM芯片具有更低的功... MRAM是一种新型非易失存储器，采用电子的自旋属性表征数据信息的存储及传输，具备高速读写、低功耗、高密度、耐擦写、宽温区和抗辐照等优势，被广泛认为是下一代非易失存储芯片的理想选择。MRAM具能够将存储器的密度与SRAM的速度结合在一起，同时始终保持非易失性和高能效。在汽车应用上面，Netslo MRAM非易失性存储器几乎可以在任何汽车系统中提高性能并降低成本，保护有价值的数据并降低成本MRA... Flash Memory Summit 2024Event Duration: Event duration Tuesday, Aug, 6, 2024 - Thursday, Aug, 8, 2024Where: Where San Francisco, California, United StatesThe memory industry's leading event, Flash ... STT-MRAMSTT-MRAM (also called STT-RAM or sometimes ST-MRAM and ST-RAM) is an advanced type of MRAM devices. STT-MRAM enables higher densities, low power consumption and reduced cost compared to reg... MRAM (Magnetic RAM) is a memory technology that uses electron spin to store information (an MRAM device is a Spintronics device). MRAM has the potential to become a universal memory - able to combi... NETSOL串行MRAM产品非常适合需要快速频繁地存储和检索数据和程序的应用程序，因为STT-MRAM具有非易失性、几乎无限的耐久性和快速写入特性。STT-MRAM它具有SPl总线接口、XIP（就地执行）功能和基于硬件/软件的数据保护机制。SPl（串行外围接口）是一个带有命令、地址和数据信号的同步串行通信接口。它比并行接口需要更少的引脚数，并且易于在系统上配置。该产品的密度范围从1Mbit到... 华大电子推出的CIU32L0超低功耗安全MCU产品线是基于ARM 32位内核，最高频率可达48MHz，具有超低功耗、高集成度、高可靠性、高安全的特点。内部集成LCD、ADC、VREFBUF、低功耗COMP、多种定时器、多个USART/I2C/SPI等丰富的外设资源，同时提供了SM4、AES、TRNG、PUF等信息安全外设，通过商密二级及EAL4+认证。华大电子华大电子是专业从事安全芯片开发的... 12月12日，富士通公告称，将以6849亿日元（约合人民币345亿元）价格将其旗下的芯片封装子公司Shinko Electric Industries（新光电气）出售给日本投资公司JIC牵头的财团，该财团包括大日本印刷（Dai Nippon Printing）和三井化学。与此同时，新光电气也表示支持，并建议股东接受该要约。JIC表示，在获得日本和海外必要的监管批准后，将在2024年8月下旬对... 近期媒体报道，新创晶圆代工厂Raapidus董事长东哲郎在SEMICON Japan 2023演讲时表示，相信日本能够在超先进晶圆制造技术竞赛上，迎头赶上领先者台积电与英特尔等，从此缩短多达20年的落后差距。东哲郎表示，Rapidus 北海道建厂计划一定会成功，并且大约在 2027~2028 年期间，相关制程技术将发生改变。因为，新兴的晶体管架构GAA（全环绕栅极排列）将取代目前主流的Fin... 随着AI、大数据等技术不断普及，业界对DRAM芯片要求持续上升，为提升性能与容量，存储器大厂纷纷瞄准先进制程技术。近期，美光对外透露了先进DRAM技术进展。日媒报道，12月13日美光日本法人高层Joshua Lee对外表示，美光日本广岛工厂将在2025年生产最先进存储器1γ DRAM。Joshua Lee指出，美光将成为第一家将EUV（极紫外光）光刻机导入日本的半导体企业。此外，美光还计划在... News HighlightsStarts supplying 16 GB mobile DRAM package to global smartphone makersLPDDR5T to be adopted in the latest smartphones along with MediaTek Dimensity 9300 mobile processor“Company to c... 31 News Highlights9.6Gbps product verified to be compatible with Qualcomm’s new Snapdragon mobile processorWith validation with global major partners completed, SK hynix to provide LPDDR5T to global s... 就SWM166开发板来讲，它的程序存储和显示素材的存储是分开来进行的，因此可以这样想见其素材是被存放到存储芯片W25Q125中。要对素材进行下载，需先下载工具软件Synwit_IMG_Tool。下载软件：由于该软件比较小，故无需进行安装，其界面如图1所示。图1 软件界面为了进行下载测试，可先利用厂家的的素材。在下载前，需使用USB转TTL模块来连接开发板的UART2。随后需分为二步来来下载素... 我们从官方提供的资料分享链接，可以获取到关于该屏的SDK包。这里再附上链接。 链接：https://pan.baidu.com/s/1IlBS3D6pl979YUKh853fRA 提取码：nicg 资料提供的比较全面，还包含了诸多基础库工程。搭建基于Keil开发环境，首先需要安装pack支持包。 pack支持包可以在华芯微特的百度云盘“01.SYNWI... 一，实验目的首先感谢论坛提供此次测评的机会，本次实验目的是通过官方资料了解产品硬件资源，在官方例程基础上修改部分代码在辅助功能菜单里，通过编码器自由设置预约时间。二，硬件资源SWM166 系列 32 位 MCU（以下简称 SWM166）内嵌 ARM® Cortex®-M0 内核，可应用于工业控制、电机控制、白色家电等多种领域。SWM166 支持片上包含精度为 1%以内的 12M 时钟及 PL... （1）支持ISP下载和SWD下载两种模式，通过上位机软件可选。（2）电源接口支持USB供电和适配器供电（5-12V）。<span]（3）适配器供电时，如果误操作接入了超过12V的电源，烧录器有过压断电保护功能。（4）提供三色指示灯用来指示烧录状态，绿色表示成功，红色表示失败，蓝色表示烧录中。<span]（5）0.96寸128*64的OLED显示屏用来显示当前烧录状态，烧录成功次数、失败次数自... 一、下载烧写种类1、PC 端下载工具软件： SYNWIT-PRG_Vx.x.x.exe2、PC 端 Userboot 功能应用下载工具： SWMProg.exe – x.x.x3、官方离线烧写器ZB103 -- SWM320RET7 固件，一拖一烧写方式。4、第三方离线烧写器芯圆 型号 ST268E0https://item.taobao.com/item.htm ... amp;id=61... 12月存储现货市场活跃度有限，本周存储成品端涨幅放缓，渠道行情仍在持续倒挂，市场整体在陆续交货及年底结算中，等待新一轮备货需求的出现。由于目前NAND Wafer资源价格高昂，推涨部分嵌入式及行业产品价格，而靠近零售端的渠道市场需要时间消化库存，存储现货行情整体倒挂加剧，市场购买力偏弱。在倒挂行情和时节因素的影响下，短期内市场对存储涨价接受度不足。近期存储成品端涨幅有所放缓，部分原厂也放缓了... 128GB CXL DRAM based on advanced CXL 2.0 interface to be mass produced this year, accelerating commercialization of next-generation memory solutionsSamsung will continue collaborating with global d... amsung's newest DRAM will optimize next-generation computing, including artificial intelligence applications, with greater power efficiency and productivitySamsung Electronics, a world leader in ad... 51 Samsung’s latest 32Gbps GDDR7 to further expand capabilities in applications for AI, HPC and automotive vehiclesEnhancements in GDDR7 include 1.4 times boost in performance and 20% improvement in p...
Samsung Starts Mass Production of Automotive UFS 3.1 Memory Solution With Industry’s Lowest Power Co
21New UFS 3.1 is optimized for IVI systems and consumes 33% less energy, providing added benefits to future automotive applicationsSamsung to build out full UFS 3.1 lineup to meet various customer ne... 40 Provides double the capacity of 16Gb modules within the same package size, enabling 128GB DRAM module production without the TSV process and decreasing power consumption by 10%The new product also ... LPDDR-based LPCAMM will lead next-gen module market for PCs and laptops, possibly extending to data centersImprovements in performance by 50%, power efficiency by 70% and mounting area by 60% compa... Delivers up to 3.8 times the transfer speeds of external HDD, and protects data from drops of up to two metersSamsung Electronics, a world leader in advanced semiconductor technology, today unveile...
Samsung Research Fellow Juho Lee Named Inaugural Recipient of IEEE ComSoc Excellence in Supporting S
57▲ Juho Lee, a fellow at Samsung Research, won the Excellence in Supporting Standardization for Communications Award from IEEE ComSoc at the GLOBECOM 2023 conference on December 5. Juho Lee, a fello... Samsung Electronics will hold a press conference on January 8, a day before exhibitions open for the 2024 Consumer Electronics Show (CES) in Las Vegas, NV. The event is scheduled to begin at 2:00 p...
Samsung Electronics Holds Memory Tech Day 2023 Unveiling New Innovations To Lead the Hyperscale AI E
15New technologies and products include HBM3E Shinebolt, LPDDR5X CAMM2 and Detachable AutoSSD to accelerate innovation for future computing requirements Samsung Electronics, a world leader in advance... 南亚科技11月自结合并营收为28.74 亿元（新台币，下同），较2022年同期增加3.71%、较10 月份也增加7.72%，为14 个月以来新高纪录。累计1-11月营收为新台币267.30 亿元，较2022 年同期减少51%。南亚科各产品线方面，服务器业务企业云端应用带动AI运算及DDR5的需求，此外，CPU 新平台、DDR5渗透率将会提升，也有利未来服务器器DRAM 需求，目前服务器的DD... 佰维存储近期在接受调研时表示，公司营业收入恢复较快，第三季度实现营业收入9.74亿元， 9月单月营收已接近5亿元，行业回暖明显，近期在手订单仍处于相对饱和的状态。佰维存储产品通过了PC行业龙头客户严苛的预装导入测试，目前已经进入联想、宏碁、同方、富士康等国内外知名PC厂商供应链 西部数据12月5日对客户发布涨价通知，预告NAND及HDD将展开浮动涨价。其中，NAND预计将在未来几个季度内呈现周期性价格上涨，累计涨幅可能达55%；HDD将采取每周审查价格，预计价格涨势将延续至2024年上半年。在CFM闪存市场最新发布的《3Q23 NAND Flash市场营收排名》中，西部数据位列第四，NAND Flash销售收入为15.56亿美元，环比增长13%，市场份额为15.9%... 据企查查数据显示，兆易创新近日获得一项发明专利授权，专利名为“一种存储器及其制备方法”，专利申请号为CN201910305735.8，授权日为2023年12月1日。专利摘要：本发明公开了一种存储器及其制备方法。其中，存储器包括：衬底基板，衬底基板包括多个有源区和多个浅槽隔离区，有源区和浅槽隔离区间隔设置；位于浅槽隔离区对应的衬底基板一侧的隔离层，隔离层内形成有凹槽结构；位于有源区对应的衬底基... 据韩媒报道，Kiwoom证券8日表示，由于第四代高带宽存储器HBM3的全面供应以及存储器价格的上涨，三星电子今年第四季度业绩将超出市场预期。预计三星电子HBM3将于今年年底明年初正式开始向包括NVIDIA在内的主要客户供货，第五代（HBM3E）量产将取得有意义的成果。报道称，三星电子第四季度营业利润将环比增长76%，达到4.3万亿韩元（约合32.8亿美元），大幅超出市场共识（3.5万亿韩元）... Kioxia最新宣布，HPE ProLiant Gen11服务器现已推出采用其 KIOXIA RM7 系列超值 SAS SSD 系列。KIOXIA RM7 系列 SSD 是该公司最新一代 12Gb/s Value SAS SSD，与 SATA SSD 相比，可为服务器应用程序提供更高的性能、可靠性和更低的延迟，从而提供更高的 IOPS/W 和 IOPS/$。KIOXIA RM7系列SAS S... 旺宏电子11月份合并营收18.09亿元（新台币，下同），较10月份减少16.5%、较2022年同期也减少34.6%，创下2019年3月以来的新低纪录。累计1-11月合并营收为257.91亿元，较2022年同期减少36.9%。旺宏董事长吴敏求先前在第三季法说会上表示，相较2023年第二季优于预期，第三季就比较不如预期，接下来的第四季也不乐观，主因是受大陆、日本客户需求不振的影响。其中，高品质N... 华邦电子含新唐科技等子公司的11月份合并营收为63.68 亿元（新台币，下同），较10月份增加1.12%，较2022 年同期减少2.33%。累计1-11月合并营收为684.99亿元，较2022 年同期减少22.21%。华邦电子总经理陈沛铭此前曾表示，现阶段看到市场PC及智能手机市场需求的确有恢复的情况，至于服务器，在包含AI服务器的情况下，市场需求也有逐渐回温趋势。预计第四季营收会跟第三季持... 美光与工会达成协议，将会兴建总值150亿美元的芯片制造设施，未来20年内将在纽约州投资多达1000亿美元。美光全球营运执行副总裁Manish Bhatia表示，新芯片制造设施预计将在高峰期间聘用约3700名建筑工人，并全部经工会招聘；预计厂房将于2026年投入生产，而到2020年代末将可创造多达2000个永久职位。美光这一举措，在美国商务部即将在年底前第一笔芯片法案补贴之际，为其在争取联邦补... 长江存储致态正式发布Ti600和TiPlus7100的4TB容量版本，售价分别为1299元和1799元。其中Ti600 4TB版本采用长江存储QLC颗粒，晶栈Xtacking 3.0架构，单颗芯片接口速度可达2400MT/s；顺序读写速度最高可达7000MB/s、6000MB/s。全面兼容Gen4及大部分Gen3系统。TiPlus7100 4TB版本则采用了长江存储TLC颗粒，同样采用了晶栈... NAND Flash控制IC厂群联电子11月份营收54.07亿元（新台币，下同），月成长近5%，创历史同期次高。累计1-11月营收币430.4亿元，年减23%。群联表示，11月份SSD控制芯片总出货量持续出现逐渐回温状况，包含整体SSD控制芯片总出货量年成长达30%，其中，PCIe SSD控制芯片总出货量年成长更是将近40%，创历史同期新高纪录。群联指出，整体NAND存储位元数总出货量的年成... 代工厂和硕11月营收1,167.81亿元（新台币，下同），月减17.88%，年增2.91%，显示iPhone拉货潮缓步下滑。累计今年前11个月营收1.17兆元，年减2.66%。展望第四季度，和硕共同执行长邓国彦之前指出，由于通讯（智能手机为主）新品刚刚推出，预估第4季营收将为2023年单季高峰，展望2024年，大家预期消费性电子及PC产业表现都将优于2023年，只是成长幅度不确定。因通讯（i... 广达公布11月营收1036.01亿元（新台币，下同），月增13.4%、年减7.6%，重回月增长的走势，累计前11个月营收9927.08亿元、年减15.53%。广达11月笔电出货较10月上涨31.03%、出货量达380万台，不过较去年同期仍年减11.62%。内部认为，第4季出货表现符合原先所预期年减双位数百分比的预估，随着市况复苏力道增强，乐观看待后续走势。有关AI服务器出货进度，广达称，虽然... 据台媒报道，台湾地区公布11月出口374.7亿美元，年增3.8%，由黑翻红；进口276.7亿美元，年减14.8%。在外销主力货品部分，据进出口统计，电子零组件出口衰退3.6%，连13黑，但幅度已有收敛；资通与视听产品外销持续畅旺，年增74%。累计今年前11月总出口值3925.6亿美元，年减11.5%。 据外媒报道，英伟达CEO黄仁勋近日表示，美国还要花上10年至20年才能真正摆脱海外依赖，实现新片供应链独立；英伟达将持续与中国大陆做生意。美国寄希望于芯片法案让美国本土生产半导体，台积电和三星先后赴美设厂；黄仁勋表示，要打破当前供应链依赖的局面，还需要10年到20年。受美国出口管制措施影响，包含英伟达在内的公司都受到冲击，不得出售先进芯片给中国大陆；对此，黄仁勋表示，英伟达正在为中国大陆设计... 据外媒报道，Omdia表示，英伟达Q3售出近50万个A100和H100 GPU，基于H100的服务器的交付周期已延长至36到52周。Meta和微软是英伟达H100 GPU的最大买家，他们都采购了15万个H100，远远超过谷歌、亚马逊、甲骨文和腾讯购买的H100处理器数量（5万个）。服务器原始设备制造商戴尔、联想、HPE还无法获得足够的GPU来完成服务器订单。Omdia预计，英伟达H100和A... 据外媒报道，据消息人士表示，英伟达已告知中国大陆客户，为遵守美国出口规定而特别为当地设计的新款人工智能（AI）芯片，将延后到明年第1季推出。报道称，延后推出的芯片是H20，这是英伟达为遵守美国新的出口限制、所开发的三款针对中国市场的芯片中，功能最强大的一款，延后推出可能打乱英伟达在中国保持市占率。英伟达原本预计最早于11月16日推出这些新产品。但消息人士称，H20的发布现已被推迟到明年第1季... 国际电子商情14日讯 日本NAND闪存生产商铠侠(Kioxia)铠侠在周二公布最新财报指出，因智能手机和个人电脑(PC)使用的存储芯片需求下滑影响了盈利，该公司第二季度运营亏损1008亿日元（约合48.48亿元人民币）。自新冠疫情大流行以来，存储芯片制造商一直在努力应对需求下滑的问题，市场供应过剩，行业整合的压力越来越大。不久之前，铠侠(Kioxia)与西部数据之间的合并谈判由于SK海力士的... 今天小编给大家带来的是SWM341系列芯片在屏驱应用下对于素材预处理环节的详细介绍：其中图片与字体是依托 LVGL 生态构建，而音视频是与 SWM341 的外设密切相关。01图片预处理输出数据格式：Binary RGB565（Swap）or 888 / C Array由于在线工具受限于网络链接，故使用离线转换工具较为快捷便利，请读者自行斟酌。 LVGL官方图片在线转换工具：https://l... 1电梯外呼面板介绍 电梯外呼面板，用于显示电梯当前位置、运行状态和楼层信息，以便乘客在等待电梯时了解电梯的运行情况。 电梯外呼面板，按显示屏的种类，分为3类，分别是LED屏、LCD断码屏、TFT彩屏。 电梯外呼面板，需要跟电梯主系统进行通讯，通讯方式主要采取CAN、LIN通讯。PART TWO市场规模- Market Scope -一、新装电梯市场中国是全球最大的新装电梯市... 国际电子商情1日讯 三星电子预计，随着人工智能(AI)应用的发展，对存储芯片的总体需求将会上升，市场可望在2024年复苏。10月31日，三星电子公布了截至2023年9月30日的第三季度财务业绩。报告期内，三星电子实现合并总营收67.4万亿韩元，环比增长12%，负责半导体的设备解决方案部门亏损收窄。三星电子指出，尽管宏观经济的不确定性可能延续，传统服务器需求不振，但AIGC催生下高端服务器需求... 近期，《国际电子商情》采访了7家存储产业链企业，我们围绕存储市场现状，未来几个季度的价格、需求趋势，以及AI对存储市场的影响等话题展开探讨。在交流中，我们有看到存储市况“不同调”的情况。过去一年多时间里，在业内各大论坛、高峰会议中，分析师和从业者都在预测，存储芯片会在今年Q4进入价格“拐点”。到2023年8月，连续下跌好几个季度的存储芯片终于迎来了涨价，截至目前其涨价趋势仍在延续。近期，《国... 存储市场一直是半导体风向的晴雨表，基于库存无法完全严格的控制，存储市场一直遵循着波浪式前进的规律在运行。2023年即将过去，在过去的第三季度和即将结束的第四季度，国际存储市场出现了向好的趋势。存储市场一直是半导体风向的晴雨表，基于库存无法完全严格的控制，存储市场一直遵循着波浪式前进的规律在运行。2023年即将过去，在过去的第三季度和即将结束的第四季度，国际存储市场出现了向好的趋势。11月韩国... 11月27日，深圳市江波龙电子股份有限公司（以下简称“江波龙”）与金士顿科技公司（Kingston Technology Corporation) 共同签署了意向性备忘录，宣布发挥各自优势，将共同出资设立合资公司，双方分别持有合资公司51%和49%的股份（后续双方将签订具体协议文件，并视届时具体安排依规履行各项审批义务及信息披露义务）。金士顿成立于1987年，总部位于美国加州芳泉谷，是全球知... 不知不觉，2023已近尾声，跌跌不休的存储行情终在四季度上演强势“翻盘”，尽管此前终端客户对涨价早有预期，但是此番涨幅之大仍超出预料。根据CFM闪存市场数据，自10月份以来，现货市场NAND Flash价格指数涨幅已达40%。数据来源：CFM闪存市场四季度合约市场价格同样呈现大幅上扬，具体涨幅CFM闪存市场已在《2023年Q3全球存储市场报告与Q4展望》报告中详细说明。数据来源：CFM闪存市... 美光科技宣布更新2024财年第1季（2023 年 9 月 -11月）收入、毛利率、运营费用和每股收益指引。美光此前预计收入为44亿美元±2 亿美元，非 GAAP 毛利率为 (4.0%) ±2%。由于供需平衡的改善和定价的改善，美光最新预计2024财年第1季的收入将接近47亿美元，非GAAP毛利率将接近盈亏平衡。图片来源：美光此前美光在上季度财报业绩会上表示，预计最早将在2024年下半年看到毛... SWM34S系列驱动TFT-LCD显示模组应用基本注意事项- SYNWIT CHIP -STEP01确认硬件的连接、包括电源、地、RGB 数据线、DCLK\DE\HSYNC\VSYNC 等，显示模组有 DISP、RESET、CS、SCL、SDA 等。STEP02确认各电压的正常，包括电源，部分有 IOVCC、VGL、VGH、VCOM 等电压。STEP03如果应用的 TFT-LCD 模组非演示... SWM166开发板测评活动进行中欢迎报名参加✦✦✦开发板型号：SWM166-SPI-Y1.28C1（华芯微特提供1.28寸、240*240分辨率的显示屏）。芯片概述✦✦✦SWM166是一款基于Cortex®-M0 的32位微控制器，片上包含精度为1%以内的12M时钟及PLL模块，最高支持90MHz的时钟输出。外设和总线资源包括 :·3 组32位（24位计数器+8位预分频）加强定时器·4 组3... PART ONE产品简介- Introduction -1什么是Ebike？Ebike全称Electric Bike，直译就是“电助力自行车”，集“人力+电力”于一身混合运行。PART TWO市场规模- Market Scope -2015年Ebike赛道在欧美兴起。伴随着锂电池愈发便携的发展，它的体积越来越小，密度越来越带，电动替代自行车的逻辑促进了Ebike产业的发展。2021年整个市场... 酒精检测仪是一种可以测量人体酒精浓度的电子设备。它可以通过呼气或血液等方式来检测酒精浓度，被广泛应用于交通安全、职业健康等领域。酒精检测仪的工作原理：1、酒精检测仪分为2种，基于化学传感器与基于光学传感器，工作原理都是通过检测被测试者呼出的气体中的酒精成分来得出酒精浓度。2、检测传感器检测到气体中的酒精成分后，会将测量结果输出至处理器，然后通过屏幕界面或数据接口等方式展示给用户。PART T... SWM211C8T7简介：SWM211C8T7为 32 位 MCU（以下简称 SWM211）内嵌 ARM® Cortex®-M0内核，凭借其出色的性能以及高可靠性、低功耗、代码密度大等突出特点，可应用于工业控制、电机控制、白色家电等多种领域。SWM211C8T7支持片上包含精度为 1%以内的 12M 时钟及 PLL 模块，最高支持 90MHz 的时钟输出。同时提供最大为 64K 字节的 FL... 1I2C 简介物理连接I2C总线由时钟线SCL、数据线SDA两根线构成，连接在其上的设备分为主机和从机两种，I2C上的通信全部由主机发起。I2C设备对总线的输出采用开漏输出结构，即它只有在总线和GND之间的NMOS管，没有总线和VDD之间的PMOS管。输出0时通过开启NMOS管将总线与GND短接；输出1时无法像推挽输出那样开启PMOS管将总线与VDD短接，而是只能通过关闭NMOS从而由外接的... PART ONE产品简介- Introduction -1带TFT彩屏电脑机箱2带小TFT彩屏电脑键盘为什么电脑机箱&键盘，要带屏？带屏的电脑机箱&键盘客户群体?电竞玩家、设计师、电子发烧友、股民......PART TWO市场规模- Market Scope -中国电脑机箱年产量约6000万台，键盘年产量约3亿个。随着电竞人群的增长，对机箱、键盘的专业化、个性化要求越来越高，带屏的产品会越... 华芯微特MCU的系列之SWM341&SWM34S，内核相同，34S在341基础上内置了SDRAM。341芯片使用安谋科技“星辰”STAR-MC1内核，基于ARM-V8指令集的架构，对应的工具版本有更高的要求，详细如下：1、KEIL版本：建议在5.33以上，兼容性更好（最好是5.33-5.36之间，5.37编译时有时报错)；2、调试工具：可用JLink或DapLink（需要支持ARM-V8版本... 芯课堂|SDRAM工作原理及时序分析1. 简介SDRAM是一种同步动态随机访问内存，它具有内置控制器，通过与CPU时钟同步来工作，使得数据传输更为高效。SDRAM在内存颗粒市场中占据主导地位，广泛应用于各种计算机系统和服务器中，为数据处理和存储提供了快速且可靠的支持。SDRAM具有高速度、高密度、低功耗等优点。其内部结构采用Bank架构，允许同时进行多个读写操作，从而提高了整体性能。此外，S... 随着智能化和物联网技术的快速发展，芯片的安全性日益受到重视，而这需要具有安全功能的MCU提供支撑。如何保证IoT设备在安全性上有所保障，就成了设计者必须解决的问题之一。作为专业从事安全芯片开发的集成电路设计企业，华大电子致力于智能卡芯片、安全SE芯片和安全MCU芯片及应用解决方案开发，累计出货量已突破200亿颗，聚焦金融科技、网络通讯、物联网、车联网、智能交通、智能制造等领域应用。众所周知，... 随着物联网、金融科技等行业的发展以及智能化产品不断涌现，信息安全问题越来越受到大家的关注。为了满足客户的安全需求，华大电子推出CIU32L0系列安全MCU产品，该产品是在通用MCU的基础上，融入TRNG、PUF、密码算法、硬件隔离、Tamper、调试保护等安全要素，提供安全调试、安全下载/启动/更新、安全隔离、安全算法、安全存储等安全服务系统功能，并依据安全要素的强度区分安全等级，不仅具备通... 近些年，随着中国医疗器械行业的发展和糖尿病患者的增多，血糖仪行业快速发展。截至目前，血糖测量技术共经历了五个发展阶段。前三个阶段基本采用光反射法测试血糖浓度，第四和第五阶段主要采用电化学法。目前国内主流血糖仪均采用电化学法进行血糖测量。诚然，当前市场上血糖仪存在着同质化的倾向，基本功能差别并不大。但是如何测量得更精细、让患者使用起来更方便，一直是所有企业共同追求的目标。指尖式血糖仪华大电子面... 全球MCU市场多为欧美、日本和台湾地区企业占据，仅欧企恩智浦、美企Microchip、美企ST、欧企英飞凌就占据超80%的份额，TI、Nuvoton、罗姆、三星、东芝五家企业占据11.4%，而中国大陆企业所占份额6.5%不到。这意味着，留给中国本土供应商的替代空间仍然非常大。恰逢近两年缺芯潮汹涌，MCU供给持续紧张，加上海外厂商供货交期长，客户转单中国本土MCU厂商，使本土供应商获得更多供货... 前言近年来，MCU市场潜力凸显。据IC Insights 数据及预测，2021年全球MCU 市场规模约196 亿美元，同比增长23.4%，预计至2026年将以6.7%的复合增速达到272亿美元。在不断扩容的市场规模叠加地缘政治的影响下，国产MCU产品将迎来新一轮应用高峰。其间，国内MCU企业将如何抢占更高市占呢？2023年7月6日，国内知名MCU企业广东华芯微特集成电路有限公司（以下简称：华... 2023年10月30日，第五届硬核芯生态大会暨2023汽车芯片技术创新与应用论坛圆满落幕。本届大会汇集半导体全产业链的领军者，广邀电子制造企业高管、项目负责人、电子工程师、投资者、资深学者与行业大咖同台演讲，为推动中国芯高质量发展贡献顶尖的思想和智慧。作为压轴环节，“2023年度硬核芯评选”获奖榜单重磅揭晓。在本次评选中，广东华芯微特集成电路有限公司从165家企业、183款产品中脱颖而出一举... 10月30日，2023年慕尼黑华南电子展在深圳国际会展中心（宝安新馆）隆重召开。华芯微特携屏驱、电控、通用MCU芯片及众多优秀产品亮相，展位号：1号馆1K39展台。同期活动：第五届硬核芯生态大会暨2023汽车芯片技术创新与应用论坛。演讲主题：华芯微特引领高性价比单芯片解决方案，演讲者：SYNWIT市场总监张琢。 AEC-Q100车规级安全：车载设备TBOX与车联网数据安全应用概述 随着车联网的普及，车辆通讯安全越来越受到了政府、车厂的关注。国家政策也在大力推广和制定车辆安全的标准化，在制造强国建设领导小组下建立车联网产业发展专项委员会，工信部牵头，联合公安部、交通部、发展改革委等20个部门，共同解决车联网发展面临的安全问题。本文我们将为大家介绍汽车T-BOX终端应用安全认证与T-BOX车联网... 192 华芯微特SWM211X高速风筒方案介绍 . 用芯创造智慧绿色生活 . 技术驱动 ·合作共赢 . 成为中国MCU行业领跑者一. 高速吹风筒主控介绍二. 高速吹风筒规格参数三. 高速吹风筒特点描述四. 高速吹风筒参考资料01高速吹风筒主控介绍 高速风筒主控介绍华芯微特电控MCU主推SWM211系列，选型表如下：华芯微特高速风筒主... 你们的屏驱MCU能满足低功耗要求？能保证开发技术支持和长期供货要求吗？”2022年夏天，MCU原厂广东华芯微特集成电路有限公司（以下简称：华芯微特）来了个新询单。该客户是国内小家电头部企业，正研发一款炒菜机新品。在方案验证过程中，发现此前选用的屏驱MCU达不到功耗要求，在分别使用了两家国内外知名MCU厂家产品后，功耗结果均不如意。且在沟通过程中，同时发现对方的技术支持配合度也不高。于是，循着... STT-MRAM是一种先进的磁阻，它利用电子自旋的磁性在半导体中提供非易失性。MRAM代表磁阻随机存取存储器，是一种使用磁状态而不是DRAM等设备使用的电荷来存储数据位的方法。STT-MRAM由三星电子公司的代工厂制造，得益于三星代工厂的28纳米FD-SOI工艺，Netsol MRAM拥有低功耗和更紧凑的尺寸。大规模生产STT-MRAM，在从物联网到医疗和汽车的广泛行业提供替代品。Netso... 华芯微特2023华南区域代理商产品交流会7月6号下午，华芯微特在登喜路大酒店举办了华芯微特2023华南区域代理商产品交流会，邀请了众多代理商、各界媒体以及客户代表齐聚一堂，共襄盛会。华芯微特总经理韩智毅博士现场致欢迎词，强调华芯微特将深耕屏驱、电机及家电等细分市场，用差异化、高性价比的产品为客户创造价值。打造好产品的路上我们要先看见，看见才能融合，通过融合提供好的产品，才能在深度融合中实现共... 应用场景ATSHA204A属于Microchip CryptoAuthentication™系列高安全性硬件验证器件。它具有灵活的命令集， 可在许多应用中使用，其中包括：•防伪证可移除、可更换或可消耗的客户端是否可信。例如，客户端可以是打印机墨盒、电子子卡、一次性医疗用品或备件。此器件也可用于验证软件/固件模块或存储器存储元件。• 交换会话密钥在系统微处理器中安全、方便地交换加密/解密引擎使... NETSOL自旋转移力矩磁阻随机存取存储器（STT-MRAM）。数据始终是非易失性的，可以取代具有相同功能的FRAM、低功耗SRAM或nvSRAM，并有助于简化系统设计。由于STT-MRAM的非易失性和几乎无限的耐久性特性，它适用于工业设计中的代码存储、数据记录、备份存储器和工作存储器。 Parallel STT-MRAM的容量范围从1Mbit到16Mbit。是一个具有并行异步接口... Netsol的Parallel STT-MRAM具有非易失特性和几乎无限的耐用性。对于需要快速存储和搜索数据和程序的应用程序来说，这是最理想的内存。可替代NOR Flash、FeRAM、nvSRAM等，具有卓越的性能和非易失特性。 Netsol中国区总代理全球芯科技提供的S3R1016是容量为1Mbit的自旋转移力矩磁阻随机存取存储器（STT-MRAM）。数据始终是非易失性的... 2020年，汽车产销量大幅下降，推到了汽车经销商崩盘的多米诺骨牌，庞大等多家经销商集团破产，国六强制执行，生存环境在自然选择的环境下，进一步“优化”汽车市场，加上疫情突袭，汽车产业由寒冬降至冰点。扛不住的行业尾部汽车制造商和经销商集团相继步入后尘，汽车产业链均受挫严重。汽车流通库存指数预警，虽然金九银十的景气有所改善，但是不难看出，增长乏力，经营压力加剧，盈利情况堪忧是整个汽车产业链的现状。... 速锐得TBOX终端符合国标GB17691-2018和GB/T32960.2-2016，在国六安全策略中，提供了技术可行的安全策略，保证TBOX各种性能处于安全范围，例如电气适用性能、环境适用性能、可靠性性能、电磁兼容性性能、一般要求、功能要求等各项指标。华大电子安全芯片详细请咨询：深圳市全球芯科技有限公司 www.chip.com.cnTBOX终端存储、传输的数据是加密的，采用非对称算法，... 自11部委发布了《柴油货车污染治理攻坚战行动计划》，随后各省都出台了响应该计划的具体实施方案，其中，东莞、山西、濮阳、洛阳、邢台、唐山、天津、扬州、合肥等省市针对国四、国五在用柴油车加装OBD排放在线监控系统就是整体行动计划中的重要措施。要求3.5吨以上重型卡车加装OBD排放在线检测系统的地区在不断增加，这种方式已经在全国范围内推行开来，各大城市会成为早期试点区域，也是国家蓝天保卫战重要一环... 25 汽车电子随着汽车的电子化，对满足汽车恶劣驾驶环境、快速耐用的非易失性解决方案的需求正在逐渐增加。 MRAM具有近乎无限的耐久性及高可靠性，是能够满足电子应用程序中这种市场需求的非易失性存储器，最为理想。MRAM的主要优势如下近乎无限的耐用性（100兆次的写入次数 ）长期数据保存（10 年）快速写入时间高可靠性高放射线耐性汽车 20 物联网物联网 (IoT) 将众多智能设备利用互联网协议技术连接起来，使它们能够相互通信。从物联网的应用程序来看，随着通过多种传感器收集处理数据并以二次电池等电池为动力进行运作的产品不断增加，对低电力存储器的需求也正在增大。 与其他现有存储器不同，MRAM消耗电流低、耐久性高，因而是非常适合物联网的存储器。MRAM的主要优势如下近乎无限的耐用性（100兆次的写入次数）低功耗保证突发断电时的安全... 企业数据存储（RAID系统）RAID（Redundant Array of Inexpensive Disks）是一种结合了两个或多个物理存储设备（HDD、SSD）的数据存储结构，它在被连接的系统中，被转换成识别为单个驱动器的逻辑单元（阵列）。 RAID控制卡的日志存储器存放重要数据，如日志和数据写入完成、奇偶校验写入、错误日志等。在断电的情况下，控制器查询日志内存，以了解从哪里开始恢复。... 32 医疗器械便携式超声波扫描仪是一种检测从物体反射的声波并将其转换为实时图像的设备。通常使用配置存储器和图像/报告存储器两种类型的存储器。配置存储器存储来自外部硬件的标识和配置信息，图像/报告存储器存储图像和相应的报告数据。这些存储器即使在突然断电的情况下，也必须能够安全地保存数据。 MRAM是最理想的存储器，即使在电源故障的情况下也能防止数据丢失，既可以用作配置存储器，也可以用作图像/报告存储... 佐思汽研发布《2022年中国汽车信息安全硬件研究报告》。一、主机厂普遍采用安全芯片+HSM的策略构建信息安全防护体系信息安全硬件的核心是安全芯片和硬件安全模块HSM。安全芯片即安全单元SE(Secure Element)，是一种内部集成了密码算法并具备物理防攻击设计的集成电路。硬件安全模块(HSM)，是一种用于保护和管理强认证系统所使用的密钥和敏感数据，并同时提供相关密码学操作的计算机设备，... 58 2023年全球芯科技将继续与您一起见证产业变迁、记录时代发展！英特尔英特尔研究院副总裁英特尔中国研究院院长 宋继强芯师爷的读者朋友们好，首先代表英特尔祝大家春节快乐，兔年大吉，万事如意！在过去的一年里，半导体行业面对业内外的诸多不确定性，依然戮力同心穿越技术周期，展现了整个行业的韧性与创造力。英特尔也在IDM 2.O的转型道路上继续推进，在底层技术和软硬件产品上取得了一系列突破，进一步提高了... 国民技术核心技术：信息安全、SoC、无线通信连接三大核心技术；关键产品：通用 MCU 产品线、）安全芯片产品线主要应用：物联网、工业联网及工业控制、智能家电及智能家庭物联网终端、消费电子、电机驱动、伺服、电池及能源管理；网络身份认证、电子银行、可信计算、电子证照、移动支付与服务器云安全、物联网安全等信息安全领域。竞争优势：实施“通用+安全”的产品战略，重点在高端高性能MCU、高可靠性车规MC... 纵观当前的IT产业发展现状我们可以看到，市场对于数据的需求是不断上涨的。哪怕是在一些已经增长比较放缓的市场，对数据的需求依旧处于上升的趋势。尤其是在人工智能的推动下，市场对数据的需求更是水涨船高。 “类似ChatGPT等人工智能相关的应用程序的增长速度以及对数据的需求更是非常庞大，光是ChatGPT-3就以1750 亿个参数进行训练的。这些人工智能应用的快速发展，也对处理器及带宽提出了更高的... 实现现有DDR5 DRAM最高运行速度和基于‘HKMG’工艺的超低功耗· 期待成功完成最高性能的1b DDR5 DRAM 产品验证· “开始量产最先进的1b工艺，以业界最高DRAM竞争力水平改善今年下半年业绩”· 明年上半年将把1b工艺扩大适用于LPDDR5T、HBM3E等高性能产品2023年5月30日，SK海力士宣布，已完成现有DRAM中最为微细化的第五代10纳米级（1b）技术研发，并将适... 据安巢发布消息，5月29日，深圳芯能半导体技术有限公司（以下简称“芯能半导体”）与安巢经开区在合肥市政府签署项目合作协议。此次签约项目采用先进工艺，专注于大功率模块封测，主要建设10条IGBT、5条SIC MOS自动化生产线，产品应用于新能源汽车、太阳能和家电等行业，项目整体建成达产后，预计可实现年产480万只IGBT模块和60万只SIC MOS模块，年营收约15亿元。资料显示，芯能半导体是... 科技创新一直是推动经济发展的重要动力，尤其在信息时代，各种技术日新月异，不断涌现的新兴行业，使得科技创新的驱动作用愈加明显。在硬件方面，安全芯片成为了保障信息安全的重要手段之一，在产业链中扮演着重要的角色。一、安全芯片的基本概念和分类安全芯片，顾名思义，就是能够确保数据和通信过程的安全性的芯片。它主要采取如下几种方式实现：1. 加密芯片：通过对数据进行加密处理和解密处理，确保信息传输的保密性... |
